Coupled Inductor Paths With Exposed Faces for Thermal Dissipation
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Solution Overview
Problem
Conventional inductor components in power supply circuits are inefficient for compact, high-current applications due to planar topologies that hinder heat dissipation and result in undesirable vertical heat flow, making them unsuitable for modern energy conversion needs.
Innovation Solution
The design incorporates an inductor device with multiple inductive paths and magnetic permeable material, featuring exposed surfaces for heat dissipation and controlled magnetic coupling, allowing for improved thermal and electrical conductivity, and includes voids in the magnetic permeable material to manage magnetic flux and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional planar inductor topology is used, then the inductor can be integrated into planar circuit boards, but heat dissipation efficiency deteriorates and vertical heat flow is undesirable
Solution Approach 1:
The patent transitions from conventional planar (2D) inductor topology to a three-dimensional vertical structure. The inductor core extends vertically from the circuit board with windings wrapped around the vertical core, enabling heat to dissipate in multiple spatial dimensions rather than being constrained to planar surfaces. This dimensional change resolves the heat dissipation bottleneck while maintaining planar board compatibility.
2Power
If wire is wound into multiple-turn coil to increase inductance, then magnetic field strength increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent employs a vertical cylindrical core with windings wrapped around it in a curved configuration. This spherical/cylindrical geometry naturally concentrates magnetic flux through the core while the vertical orientation reduces the horizontal space required for multiple turns. The curved winding path around the vertical core achieves high inductance with fewer turns compared to planar configurations, reducing manufacturing complexity.
3Volume of moving object
If compact inductor design is implemented for high-current applications, then space efficiency improves, but thermal management becomes more difficult
Solution Approach 1:
The vertical three-dimensional structure allows heat to escape upward from the inductor core and windings, utilizing the vertical dimension for thermal management. The exposed top surface of the vertical core and the outer surfaces of the windings provide additional heat dissipation areas that are not present in planar designs. This enables compact footprints while maintaining effective thermal pathways.
4Power
If magnetic permeable material is added to enhance magnetic coupling, then inductance increases, but heat dissipation capability may be reduced
Solution Approach 1:
The patent applies magnetic permeable material selectively in specific regions where magnetic flux concentration is needed, rather than uniformly throughout the entire inductor structure. The vertical core is made of magnetic permeable material to guide and concentrate flux, while the windings and external surfaces remain as conductive materials optimized for electrical performance and heat dissipation. This localized application maintains inductance while preserving thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more efficient heat dissipation and magnetic coupling, addressing the inefficiencies of conventional inductors by improving thermal conductivity and reducing inductive coupling, thus enhancing the performance of power supply circuits in compact, high-current applications.
Implementation Method 1
The magnetic permeable material may be disposed between the first face and the second face and carries magnetic flux associated with the first inductive path
Implementation Method 2
The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face
Data Source
Figure 1
Figure 2A~2D
Figure 3A~4B
AI summary
An inductor device (110) includes a first face (109-1), a first inductive path(131), and magnetic permeable material (115). The first face couples the inductor device to a circuit board. The first inductive path extends between a first terminal (121) on the first face to a second terminal (122) on the first face. A portion of the first inductive path is exposed on a second face (109-2) of the inductor device. The second face is disposed opposite the first face. The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face. The magnetic permeable material is disposed between the first face and the second face and carries magnetic flux associated with the first inductive path.