Inductor Via Segmentation for Low Resistance and Uniform Insulation
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Solution Overview
Problem
High-frequency inductors face challenges in maintaining sufficient Q-factor characteristics due to high resistance, which is difficult to reduce without increasing coil pattern thickness, leading to issues like cracking and delamination, and conductive paste vias can degrade Q-characteristics by increasing resistance and causing non-uniform insulating distances.
Innovation Solution
The inductor design incorporates a via with a first conductive layer and a second conductive layer formed on the first layer, including conductive powder and organic material, to lower resistance and improve Q-characteristics, while using a method of forming a coil pattern on a substrate, covering it with an insulating layer, creating through-holes, and stacking separated layers to form a body with uniform insulating distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the thickness of the coil pattern is increased to lower resistance, then Q-characteristics are improved, but cracking and delamination occur during stacking due to thickness difference
Solution Approach 1:
The via is segmented into two distinct conductive layers: a first conductive layer (electroplated metal) providing mechanical strength and uniform insulating distance, and a second conductive layer (conductive paste) providing low resistance. This segmentation allows each layer to fulfill its specific function without compromising the other, resolving the contradiction between lowering resistance and preventing structural defects
Solution Approach 2:
The via employs a composite structure combining two different conductive materials with complementary properties. The electroplated metal layer provides structural integrity and uniformity, while the conductive paste layer provides excellent electrical conductivity. This composite approach enables simultaneous achievement of low resistance and high reliability
2Manufacturing precision
If vias are formed by electroplating to ensure uniform insulating distance, then manufacturing precision is improved, but resistance of the coil increases due to hardness increase during stacking
Solution Approach 1:
The via is divided into two functional layers: the first conductive layer (electroplated) ensures uniform insulating distance and mechanical stability, while the second conductive layer (conductive paste) compensates for resistance increase by providing excellent electrical conductivity. This segmentation resolves the contradiction between manufacturing precision and electrical performance
Solution Approach 2:
The invention changes the material parameter of the via by introducing a second conductive layer with superior electrical conductivity. This parameter change compensates for the resistance increase caused by electroplating hardness, maintaining low overall resistance while preserving the uniform insulating distance provided by the electroplated layer
3Loss of energy
If vias are formed by printing conductive paste to lower resistance, then Q-characteristics are improved, but insulating distances become non-uniform
Solution Approach 1:
The via structure is segmented into an electroplated metal layer that ensures uniform insulating distance and a conductive paste layer that provides low resistance. The electroplated layer serves as a uniform base that compensates for the non-uniformity inherent in screen printing, allowing the conductive paste to achieve low resistance without compromising insulating distance uniformity
Solution Approach 2:
The electroplated metal layer acts as an intermediary between the insulating layer and the conductive paste. It provides a uniform, hard surface that maintains consistent insulating distance, while allowing the conductive paste to be printed with optimized resistance characteristics. This intermediary resolves the contradiction between uniformity and conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces coil resistance and enhances Q-characteristics by using a conductive paste with organic material, ensuring uniform insulating distances and preventing defects like cracking and delamination, thus improving the efficiency of high-frequency inductors.
Implementation Method 1
the second conductive layer includes a conductive powder and an organic material. Resistance of the coil may be lowered and Q-characteristics may be improved
Data Source
AI summary
An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.