Inflatable Sealing Mechanism for Electrochemical Substrate Clamping
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Solution Overview
Problem
Existing electrochemical treatment devices for substrates face challenges such as complex assembly and disassembly, limited treatment area, and risk of substrate damage due to uneven sealing and capillary action, which hinder industrial efficiency and effectiveness.
Innovation Solution
A support device with inflatable deformable elements that compress non-inflatable applique seals to ensure firm substrate holding and effective sealing, allowing for quick assembly and disassembly, and maximizing the treated surface area, while preventing electrolyte infiltration and allowing for adjustable compression to accommodate various substrate shapes and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer holder is composed of two removable parts that are screwed together, then the substrate can be securely held, but the assembly and disassembly process becomes time-consuming and complex
Solution Approach 1:
The device is divided into a fixed support structure and a removable wafer holder that can be independently assembled and disassembled. The wafer holder itself is segmented into two parts that clamp the substrate, allowing quick attachment to and removal from the support without unscrewing the entire device.
Solution Approach 2:
The wafer holder uses a dynamic clamping mechanism with inflatable deformable elements that can be quickly deployed and released. The holder transitions between an open state for easy substrate insertion and a closed clamped state for secure holding, enabling rapid assembly and disassembly cycles.
2Reliability
If the wafer holder covers a large portion of the substrate edge to ensure sealing, then the seal is more effective, but the treatable surface area is reduced
Solution Approach 1:
The sealing function is localized to specific regions where it is most needed. The wafer holder employs peripheral sealing means concentrated at the edges and corners of the substrate, rather than covering the entire perimeter. This localized sealing approach maintains effective sealing while maximizing the central treatable surface area.
Solution Approach 2:
Separate peripheral sealing means are introduced as intermediary elements between the wafer holder and the substrate edge. These sealing elements can be independently adjusted and positioned to provide effective sealing with minimal coverage of the treatable surface.
3Reliability
If the substrate is tightly clamped to ensure good contact, then the seal is improved, but the risk of substrate damage increases
Solution Approach 1:
The clamping force is made adjustable and controllable through the inflatable deformable elements. The system can transition from a loose state during substrate insertion to a controlled tight state during treatment. The inflation pressure can be precisely regulated to achieve adequate sealing without excessive force that could damage the substrate.
Solution Approach 2:
The inflatable deformable elements provide a cushioning effect during the clamping process. Rather than applying sudden high force, the gradual inflation allows the substrate to be gently pressed into position and sealed, preventing damage while achieving good contact.
4Device complexity
If the wafer holder is designed as a single integrated piece, then the structure is simpler, but the adaptability to different substrate shapes and sizes is reduced
Solution Approach 1:
The support device is designed with universal adaptability through the combination of a fixed support structure and interchangeable wafer holders. The support provides a stable base, while the wafer holder can be configured for different substrate types. The peripheral sealing means and clamping mechanism can accommodate various shapes and sizes, making the system versatile without requiring complete redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables rapid and efficient electrochemical treatment with improved substrate holding and sealing, minimizing damage and allowing for flexible treatment of multiple substrates with precise control over the treatment area, enhancing industrial applicability and process reliability.
Implementation Method 1
at least one inflatable deformable element arranged around said applique seal, opposite the opening, to ensure the gasket applies to itself to exert compressive forces transverse to the edge of the support frame and directed towards the opening
Implementation Method 2
inflatable deformable means to ensure the gasket has '' applies to exert compressive forces
Implementation Method 3
Peripheral sealing means are housed in a groove of the insert holder. When the two parts of the wafer holder are closed on the wafer, the sealing means are thus compressed against the two opposite faces of the substrate to be treated
Data Source
Figure 1~4
Figure 5~9
Figure 10a~10b
AI summary
The present invention relates to a support device for at least one substrate to be chemically or electrochemically treated, comprising a support (3) having at least one through opening (37), and sealing means (4) comprising an application gasket (40) intended to be applied against the substrate, and at least one inflatable element (41) opposite the opening, applied against the application gasket (40) and capable of exerting compression against said application gasket. This substrate clamping device operates by pressurizing or depressurizing the inflatable element and ensures a seal between the two opposite faces of the substrate, maximizing the surface area of the substrate to be treated and controlling the treatment of the substrate's edge.