Sealing Devices TRIZ Cases
- Magnetic Substrate Holder Locking for Cleaner Wet Processing
A magnetically actuated lock fixes substrate holding members without contact passages, reducing solution buildup and easing cleaning.
- Multi-Clamper Substrate Holder for Thin Wafer Flatness
Distributed clampers with lock and semi-lock claws hold large thin substrates flat for double-sided electroplating while limiting solution retention.
- Stacked Wafer Processing Modules for Compact Electrochemical Plating
Vertical wafer modules replace long linear baths to cut tool footprint while preserving maintenance access and parallel electrochemical processing.
- Solar Cell Electroplating Support for Seed-Layer-Free Copper Deposition
A support structure enables seed-layer-free copper electroplating on solar cells, reducing wafer breakage, masking steps, and silver use.
- Substrate Holder Seal Ring Opening Ratio for Plating Uniformity
A substrate holder seal ring with a specific opening diameter ratio controls electric field density during electroplating.
- Inflatable Sealing Mechanism for Electrochemical Substrate Clamping
Segmented wafer holders with inflatable clamping resolve assembly time versus reliability trade-offs while maximizing treatable surface area.
- Membrane-less Anode Chamber for Gold Plating Bath Stability
A membrane-less anode chamber forces electrolyte flow through a composite meshed anode to enhance oxidation and irrigation.
- Substrate Holder with Dummy Substrate for Plating Mode Switching
Segmentation and dynamics principles enable a single holder to switch between single-side and double-side plating by attaching a non-conductive dummy substrate.
- Plating Chuck Cover Plate Shields Notch Electric Field
A plating chuck cover plate shields the notch area electric field to prevent excessive metal deposition on adjacent patterned regions.
- Substrate Holder Positioning Member for Plating Uniformity
A substrate holder uses a rigid positioning member driven by a mechanical actuator to center semiconductor wafers.