Substrate Holder with Dummy Substrate for Plating Mode Switching
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Solution Overview
Problem
Existing substrate holders for plating devices are limited in their ability to accommodate both single-side and double-side plating processes without significant design modifications, and they often fail to protect one surface of the substrate from the plating solution effectively.
Innovation Solution
A substrate holder design that includes a first frame with one opening for exposing one surface of the substrate and a second frame with another opening for exposing the other surface, with a detachable dummy substrate made of non-conductive material that protects one surface from the plating solution, allowing the holder to be used for both single-side and double-side plating by selecting the presence or absence of the dummy substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate holder is designed for double-side plating with both surfaces exposed, then both surfaces can be plated simultaneously, but one surface cannot be protected from the plating solution
Solution Approach 1:
The substrate holder is segmented into multiple functional components: a holder body with first and second openings for exposing different surfaces, and a detachable dummy substrate that can be selectively positioned. This segmentation allows the system to switch between double-side plating mode (both openings exposed) and single-side plating mode (one opening blocked by dummy substrate), resolving the contradiction between productivity and harmful factor exposure.
Solution Approach 2:
The dummy substrate is designed to be detachable and movable, allowing dynamic reconfiguration of the holder's functionality. By attaching the dummy substrate to the holder body, one surface is protected from plating solution while maintaining the same holder structure, thus enabling transition between plating modes without redesign.
2Object-affected harmful factors
If a substrate holder is designed for single-side plating with one surface protected, then one surface can be protected from the plating solution, but both surfaces cannot be plated simultaneously
Solution Approach 1:
The detachable dummy substrate enables dynamic switching between single-side and double-side plating configurations. When the dummy substrate is attached, it protects one surface for single-side plating; when detached, both surfaces are exposed for simultaneous double-side plating, thus resolving the productivity limitation.
Solution Approach 2:
The substrate holder is designed with universal functionality to perform both single-side and double-side plating operations using the same basic structure. The holder body with multiple openings can accommodate different plating modes by simply attaching or detaching the dummy substrate, eliminating the need for separate specialized holders.
3Reliability
If different substrate holders are designed for single-side and double-side plating, then each plating mode can be optimized, but device complexity increases
Solution Approach 1:
A single universal substrate holder design incorporates features for both single-side and double-side plating through the detachable dummy substrate mechanism. This eliminates the need for maintaining separate specialized holders, reducing device complexity while preserving optimized plating capabilities for both modes.
Solution Approach 2:
The holder is segmented into a permanent holder body and a detachable dummy substrate component. This segmentation allows the same holder body to serve multiple functions by simply reconfiguring the dummy substrate attachment status, avoiding the complexity of designing and managing multiple complete holder systems.
4Reliability
If a dummy substrate is made conductive, then electrical contact can be established, but direct current flows through it causing plating on the dummy substrate
Solution Approach 1:
The dummy substrate is specifically designed with non-conductive material properties, changing the electrical parameter from conductive to non-conductive. This prevents direct current from flowing through the dummy substrate, thereby eliminating unwanted plating while still allowing the dummy substrate to serve its protective and positioning functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible use of the substrate holder for both single-side and double-side plating without altering the holder's design, effectively protecting one surface from the plating solution and accommodating substrates of various thicknesses.
Implementation Method 1
formed of a material that at least a direct current does not substantially flow therein
Implementation Method 2
a plating device for plating a substrate such as a silicon wafer or the like
Data Source
AI summary
A substrate holder capable of being used in both single-side plating and double-side plating is required. Disclosed is a substrate holder for holding a substrate to be plated. The substrate holder includes a first frame having a first opening for exposing one surface of the substrate and a second frame having a second opening for exposing the other surface of the substrate, and the substrate is sandwiched between the first frame and the second frame. The substrate holder further includes a dummy substrate which is detachably disposed between the first frame and the substrate and formed of a material that at least direct current does not substantially flow therein. At least a part of the dummy substrate is in contact with at least a part of the one surface of the substrate, and the dummy substrate protects the one surface of the substrate from a plating solution.