Stacked Wafer Processing Modules for Compact Electrochemical Plating
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Solution Overview
Problem
Existing semiconductor wafer processing systems have a large tool footprint due to the linear arrangement of multiple processing baths, making them inefficient in terms of space usage and complicating maintenance access.
Innovation Solution
A vertically stacked wafer processing system with independently removable processing modules that allow for efficient use of space and easy maintenance, featuring a transfer mechanism for automated wafer handling and a fluid seal system to prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple processing baths are arranged in a linear fashion, then each bath is easily accessible for maintenance, but the tool footprint becomes very large
Solution Approach 1:
The patent transitions from a linear horizontal arrangement of processing baths to a vertical stacked configuration. Multiple processing modules are arranged in the vertical dimension rather than extending horizontally, thereby reducing the tool footprint while maintaining accessibility through side-opening module design.
Solution Approach 2:
The processing system is divided into discrete, independently removable modules that can be accessed individually. Each module contains specific processing baths or functions, allowing maintenance personnel to access and service specific modules without disrupting the entire system, thus maintaining ease of operation while enabling compact vertical stacking.
2Adaptability or versatility
If a linear arrangement of processing baths is used, then the system can accommodate multiple processing steps, but the length of the tool exceeds 6 meters
Solution Approach 1:
The patent reconfigures the processing system by stacking multiple processing modules vertically instead of arranging them in a horizontal line. This dimensional transformation allows the system to accommodate numerous processing steps (high adaptability) while keeping the horizontal footprint compact, reducing the overall tool length to under 6 meters.
Solution Approach 2:
Multiple processing modules are nested vertically within a compact footprint. Each module can be stacked above another, creating a tower-like structure that maximizes vertical space utilization. This nesting approach allows numerous processing steps to be incorporated without proportionally increasing the horizontal tool length.
3Area of stationary object
If processing modules are stacked vertically, then the tool footprint is reduced, but access for maintenance becomes difficult
Solution Approach 1:
The vertical stack is segmented into discrete, independently removable modules. Each module can be accessed individually from the side, allowing maintenance personnel to service specific processing baths or components without needing to access the top of the stack or disassemble the entire structure. This segmentation maintains ease of operation despite vertical stacking.
Solution Approach 2:
The modules are designed with dynamic accessibility - they can be removed and repositioned as needed for maintenance. The side-opening design allows modules to be accessed from multiple angles and positions, providing flexible maintenance access that adapts to different service requirements while maintaining the compact vertical footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces the tool footprint while maintaining high throughput and allowing easy access for maintenance, enabling efficient processing of multiple wafers in parallel with improved operational efficiency.
Implementation Method 1
A potential is applied between the wafer (acting as a cathode) and a second electrode (acting as an anode) such that species in the electrolyte are deposited on the front face of the wafer
Implementation Method 2
A fluid seal is formed between the wafer holding fixture and the front face of the wafer to prevent any electrolyte from contaminating the electrical contacts or the back face of the wafer
Implementation Method 3
the electrolyte may be circulated within the electrolyte bath by means of a pump at relatively high flow rates, for example at 8-40 litres per minute
Implementation Method 4
The wafer may be rotated to establish a uniform diffusion layer thickness across the wafer surface which helps to deposit a uniform layer
Data Source
AI summary
According to the invention there is provided an apparatus for processing a front face of a semiconductor wafer comprising: a main chamber; at least one loading port connected to the main chamber for introducing the wafer to the main chamber; at least one stack of wafer processing modules comprising three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module; and a transfer mechanism for transferring the wafer between the loading port and the processing modules.