Multi-Clamper Substrate Holder for Thin Wafer Flatness

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Solution Overview

Problem

Existing substrate holders face challenges in securely holding large-sized thin substrates during electroplating processes, particularly in preventing deflection and ensuring efficient plating on both surfaces.

Innovation Solution

A substrate holder design featuring a front frame, a rear frame, and clampers with hook portions and plates, allowing for adjustable clamping to accommodate substrates of varying sizes and thicknesses, while maintaining a thin profile to minimize plating solution retention and prevent interference with plating tanks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a substrate holder with traditional clamping structure is used, then it can hold substrates, but it causes deflection of large-sized thin substrates

Engineering Contradiction:

Improvesubstrate holding stabilityVSAvoidsubstrate flatness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The clamping structure is divided into multiple independent clampers distributed across the substrate surface. Each clamper independently applies clamping force at specific locations, preventing substrate deflection without requiring excessive overall clamping pressure that would cause flatness issues.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate receive differentiated clamping forces through strategically positioned clampers. The clampers apply localized pressure exactly where needed to prevent deflection, while leaving other regions uncompressed to maintain substrate flatness and enable proper plating.

Inventive Principle:

Principle #3Local quality

2Strength

If a thick substrate holder is used, then it provides structural support, but it increases apparatus size and retains excessive plating solution

Engineering Contradiction:

Improveholder structural supportVSAvoidplating solution retention

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The substrate holder employs a thin-profile structure with flexible yet sufficiently strong materials that can provide necessary structural support without excessive thickness. This minimizes plating solution retention while maintaining adequate strength for holding substrates during the electroplating process.

Inventive Principle:

Principle #30Flexible shells and thin films

3Adaptability or versatility

If multiple claws are provided on the plate, then it accommodates various substrate sizes, but it increases device complexity

Engineering Contradiction:

Improvesubstrate size accommodationVSAvoidclamper structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The plate with multiple claws at different positions serves as a universal clamping interface that can accommodate substrates of various sizes. The same plate structure with strategically positioned claws can adapt to different substrate dimensions without requiring multiple specialized components, thereby maintaining simplicity while achieving versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12288707B2Substrate holder

Publication Date: 2025.04.29 EBARA CORP

AI summary

One object of this application is to provide an advanced substrate holder including a clamper. A substrate holder for holding a substrate by interposing the substrate between frames is disclosed. The substrate holder includes a front frame, a rear frame, and one or a plurality of clampers. Each of the clampers includes a hook portion including a hook base and a hook main body, and a plate including at least one claw. At least one of the clampers includes the plate including a first claw for a lock and a second claw for a semi-lock.