Infrared Ray Detecting Element Stress Balancing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional infrared ray detecting elements experience twisting due to uneven stress distribution between support portions, leading to tilting, sensitivity deterioration, and potential disconnection of lead wiring patterns, which compromises detection ability.

Innovation Solution

The infrared ray detecting element features a substrate with a cavity and support portions that have specific stacking sequences of wiring patterns and insulating layers to balance stress, preventing twisting and maintaining detection sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the lead wiring pattern, insulating layer, and interlayer insulating film are stacked in different orders between support portions, then the electrical connection is established, but stress balance is lost causing twisting

Engineering Contradiction:
Improveelectrical connectionVSAvoidstress balance
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent applies asymmetry by making the stacking sequences of lead wiring patterns and insulating layers different between the first and second support portions. Specifically, the first support portion has a different arrangement of lead wiring patterns and insulating layers compared to the second support portion, which compensates for the asymmetric placement of external lead portions and maintains stress balance while achieving electrical connection.

Inventive Principle:
Principle #4Asymmetry

2Measurement precision

If the infrared ray detecting portion is separated from the substrate, then heat diffusion is prevented, but twisting occurs due to uneven stress

Engineering Contradiction:
Improveinfrared ray detection sensitivityVSAvoidstructural alignment
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by providing different stacking configurations of lead wiring patterns and insulating layers at different locations (first and second support portions). This localized differentiation allows each support portion to have appropriate stress characteristics that compensate for the separation of the infrared ray detecting portion from the substrate, preventing twisting while maintaining detection sensitivity.

Inventive Principle:
Principle #3Local quality

3Stability of the object's composition

If support portions are provided in diagonal lines, then the infrared ray detecting portion is stabilized, but lead wiring patterns may disconnect due to twisting

Engineering Contradiction:
Improvesupport structureVSAvoidlead wiring connection
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent applies asymmetry in the stacking sequence of lead wiring patterns and insulating layers between the first and second support portions. This asymmetric design compensates for the diagonal arrangement of support portions, maintaining stress balance and preventing twisting that would otherwise cause lead wiring pattern disconnection, thereby ensuring reliable electrical connection.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents twisting of the infrared ray detecting portion, ensuring consistent sensitivity and preventing damage to support structures and lead wiring patterns, thus maintaining reliable infrared detection.

Implementation Method 1

An infrared ray detecting element receives infrared rays which cause the infrared ray detecting element to generate heat, and thus raise the temperature of the infrared ray detecting element

Methodology Applied
Scientific EffectInfrared radiation absorption: Absorption (EM radiation)

Implementation Method 2

An infrared ray detecting element, which uses pyroelectric substance material, detects infrared rays by utilizing the charge produced on its surface due to the temperature change

Methodology Applied
Scientific EffectPyroelectric effect: Pyroelectric Effect

Implementation Method 3

A resistance bolometer infrared ray detecting element, which uses a resistance bolometer material, detects infrared rays by utilizing resistance values which change due to the temperature change

Methodology Applied
Scientific EffectResistive change with temperature: Thermistor

Implementation Method 4

A thermopile infrared ray detecting element detects infrared rays by utilizing the Seebeck effect in which thermoelectromotive force is produced by a temperature difference

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 5

The structure in which the infrared ray detecting portion is separated from the substrate is an insulating structure capable of preventing the heat of the infrared ray detecting portion from diffusing to the substrate

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS9423304B2Infrared ray detecting element and infrared ray detector including the same
Publication Date: 2016.08.23 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US9423304B2 patent drawing
  • US9423304B2 patent drawing
  • US9423304B2 patent drawing

AI summary

An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.