Infrared Disassembly of Plasma Display Panel Bonding
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Solution Overview
Problem
The rapid increase in used and defective plasma display devices poses challenges in efficient disassembly and recycling, as existing methods are inefficient and strain disassembly plants, necessitating a more effective method to separate plasma display panels from metal support plates and circuit boards.
Innovation Solution
The method involves irradiating the plasma display panel with infrared rays from the side while directing air to the circuit board to heat the bonding member between the panel and the metal support plate, reducing bonding strength and facilitating separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heating is performed by a hot plate to separate the PDP from the metal support plate, then the bonding strength of the bonding member decreases, but the disassembly process becomes time-consuming and reduces processing efficiency
Solution Approach 1:
The patent replaces the conventional hot plate heating method with infrared ray irradiation. The infrared ray irradiation unit emits infrared rays that directly heat the bonding member through radiation, eliminating the need for thermal conduction through a hot plate. This substitution significantly reduces heating time and improves disassembly efficiency while maintaining effective bonding strength reduction.
Solution Approach 2:
The patent employs periodic or controlled infrared ray irradiation to heat the bonding member. By controlling the irradiation duration and intensity, the bonding member is heated only when and where needed, reducing overall processing time compared to continuous hot plate heating. This allows for precise thermal management during the disassembly process.
2Productivity
If the number of disassembly plants is kept constant, then operational costs are controlled, but the disassembly processing ability per plant becomes insufficient to handle the increasing volume of plasma display devices
Solution Approach 1:
By replacing hot plate heating with infrared ray irradiation, each disassembly plant achieves significantly higher processing capacity. The infrared method rapidly heats and separates components, allowing existing plants to handle increased volumes without expansion, thus maintaining the current number of facilities while improving overall processing ability.
Solution Approach 2:
The patent changes the heating parameters from conventional thermal conduction (hot plate) to radiant heating (infrared rays). This parameter change enables faster heating rates and more efficient energy transfer, directly increasing the throughput capacity of each disassembly plant without requiring additional facilities.
3Productivity
If rapid heating is performed to improve disassembly speed, then productivity increases, but temperature control becomes difficult and may damage components
Solution Approach 1:
The infrared ray irradiation unit is positioned to irradiate specifically the bonding member area, concentrating thermal energy where needed. This localized heating approach enables rapid temperature increase at the bonding interface while maintaining better control over overall temperature distribution, preventing damage to surrounding components through targeted energy delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid and efficient disassembly of plasma display devices, reducing the time required to separate components and improving the operating environment by minimizing temperature increases and odor generation, thereby enhancing recycling capabilities.
Implementation Method 1
performing irradiation with infrared rays from a side of the front plate constituting the plasma display panel while air is sent to the circuit board attached to the metal support plate to heat the bonding member between the plasma display panel and the metal support plate
Data Source
AI summary
The present disclosure relates to a method for disassembling a plasma display device including PDP (11) having front plate (20) and rear plate (21), metal support plate (14) bonded to rear plate (21) of PDP (11) with bonding member (16) interposed therebetween, and circuit board (15) attached to metal support plate (14). The method includes performing irradiation with infrared rays from a side of front plate (20) constituting PDP (11) while air is sent to circuit board (15) attached to metal support plate (14) to heat bonding member (16) between PDP (11) and metal support plate (14) so as to decrease bonding strength, and then separating PDP (11) from metal support plate (14).