Infrared Spectral Sensor Pixel Array for Compact Material Estimation

The patent combines multiple spectral sensing capabilities into a single image sensor by integrating multiple pixels with different spectral sensitivity characteristics. This merging approach eliminates the need for separate image sensors, band-pass filters, and prisms, thereby reducing device complexity while maintaining the ability to estimate object color or material accurately through spectral analysis

The single image sensor is designed to perform multiple spectral measurement functions simultaneously by incorporating pixels with different spectral sensitivities. This multi-functional sensor can capture spectral information across different wavelength ranges without requiring separate dedicated sensors for each spectral band, thus simplifying the overall device structure

The patent merges multiple spectral sensing components into a single compact image sensor module. By integrating multiple pixels with different spectral sensitivities on one sensor chip, the system eliminates the need for large optical components like prisms and multiple separate sensors, thereby significantly reducing the overall device footprint while preserving spectral measurement precision

The patent transitions from a spatial arrangement of multiple separate sensors and optical components to a planar integration of multiple spectral sensing pixels within a single sensor chip. This dimensional reorganization allows spectral measurement capabilities to be packed into a much smaller area by utilizing the two-dimensional pixel array structure of the image sensor