Injection Molded Circuit Carrier with Integrated PCB

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Solution Overview

Problem

Existing electronic units with circuit boards require complex and bulky designs to accommodate multiple components, which increases size and production costs, particularly in compact devices like hearing aids.

Innovation Solution

Integrating a circuit board into an injection-molded circuit carrier with conductive tracks, where the circuit board's surface lies within the plastic part and is connected via soldering or conductive adhesive, allowing for a compact and robust electronic unit with high integration levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a circuit board is integrated into an injection-molded circuit carrier with conductive tracks, then the size and complexity of the electronic unit is reduced, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvesize of electronic unitVSAvoidintegration precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent merges the circuit board with the injection-molded circuit carrier by introducing the circuit board into a receptacle formed in the circuit carrier during the injection molding process. The conductive tracks are integrated directly into the circuit carrier, eliminating the need for separate connection elements. This merging of previously separate components (circuit board and circuit carrier) into a single integrated structure reduces the overall size and complexity while the molding process ensures precise positioning and alignment.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If multiple electronic components are packed into a small volume for hearing aids, then the cosmetic appearance is improved, but the device complexity increases

Engineering Contradiction:
Improvehousing volumeVSAvoidcomponent integration complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent applies nesting by placing the circuit board inside a receptacle that is formed within the injection-molded circuit carrier. This nested arrangement allows the circuit board to be housed within the three-dimensional structure of the circuit carrier, maximizing space utilization. Additionally, electronic components can be mounted on both the circuit board and the circuit carrier surface, further increasing integration density within the limited volume required for hearing aid applications.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the complexity and size of the electronic unit, enabling a highly integrated and compact design while reducing production costs, suitable for applications like hearing aids with enhanced functionality.

Implementation Method 1

the conductive track of the circuit board and the conductive track of the injection-molded circuit carrier are connected by soldering

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 2

the conductive track of the circuit board and the conductive track of the injection-molded circuit carrier are connected with the aid of an electrically conductive adhesive

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9374891B2Injection moulded circuit carrier having an integrated circuit board
Publication Date: 2016.06.21 SIVANTOS PTE LTD
  • US9374891B2 patent drawing
  • US9374891B2 patent drawing
  • US9374891B2 patent drawing

AI summary

An electronic unit has a circuit board that is integrated into an injection molded circuit carrier. A hearing aid is provided with such an electronic unit. In order to reduce the complexity and size of an electronic unit with an injection molded circuit carrier and a circuit board, the circuit board is integrated into the injection molded circuit carrier by introducing the circuit board into the plastic mold such that the surface of a first side of the circuit board lies within the plastic mold and the surface of a second side of the circuit board is substantially flush with the surface of the plastic mold. At least one conductive track of the circuit board is electrically conductively connected to at least one conductive track of the injection molded circuit carrier.