Inkjet Cooling System for High-Density Electronics
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Solution Overview
Problem
The increasing miniaturization and component density of semiconductor devices lead to higher power dissipation, making heat removal a challenging technical issue, particularly in densely packed electronic apparatuses.
Innovation Solution
A cooling system utilizing an inkjet spraying apparatus to controllably deliver droplets of a cooling fluid to heat generating components, with a cooling plate in thermal communication with a heat exchanger, allowing for efficient heat transfer and flexible placement, enabling high heat removal while minimizing energy consumption and footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If component density is increased to achieve miniaturization, then device functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes phase change of cooling fluid from liquid to vapor when it contacts the heat generating component, absorbing large amounts of heat energy. The vapor then travels to the cooling plate where it condenses back to liquid, releasing heat to the heat exchanger. This phase transition mechanism enables efficient heat removal from high-density components.
Solution Approach 2:
The patent extracts the heat exchanger from the direct cooling path, placing it remotely on the cooling plate rather than requiring it to be in direct contact with the heat generating component. This allows the cooling system to serve high-density components while the heat exchanger can be positioned optimally for heat dissipation.
2Loss of energy
If cooling fluid is delivered directly to heat generating components, then heat removal efficiency is improved, but device footprint increases
Solution Approach 1:
The cooling fluid undergoes phase change from liquid to vapor at the heat generating component surface, enabling highly efficient heat absorption in a minimal space. The vapor phase allows the fluid to travel through narrow channels to the cooling plate, minimizing the footprint while maintaining high heat removal efficiency.
Solution Approach 2:
The patent introduces vapor as an intermediary carrier between the heat generating component and the cooling plate. The vapor phase of the cooling fluid acts as a mobile heat carrier that can traverse the system with minimal space requirements, enabling efficient heat transport without increasing device footprint.
3Loss of energy
If heat exchanger is placed in direct contact with cooling fluid source, then heat transfer efficiency is improved, but system flexibility and placement options are reduced
Solution Approach 1:
The heat exchanger is extracted from the immediate vicinity of the heat generating component and placed remotely on the cooling plate. This extraction maintains effective heat transfer through the cooling fluid's phase change and vapor transport mechanism, while providing significant flexibility in system layout and component placement.
Solution Approach 2:
The vapor phase of the cooling fluid serves as an intermediary that bridges the gap between the heat generating component and the remotely positioned heat exchanger. This intermediary mechanism maintains high heat transfer efficiency while enabling flexible system configuration and component placement.
4Temperature
If cooling system is added to high-density electronic apparatus, then heat dissipation is improved, but energy consumption increases
Solution Approach 1:
The cooling system is designed to be self-driven by the heat energy from the components themselves. The heat generated by high-density components automatically drives the phase change and vapor flow of the cooling fluid, eliminating the need for external pumps or fans. The system uses the problem (heat) as its own driving force, minimizing additional energy consumption.
Solution Approach 2:
The phase transition of the cooling fluid from liquid to vapor and back is driven by the heat energy from the components. This natural phase change process provides highly efficient heat transfer without requiring additional energy input, as the heat being removed is the same heat that drives the cooling mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat removal from densely packed electronic components with minimal energy consumption and small footprint, optimizing cooling fluid delivery based on changing heat dissipation levels, and preventing local hot spots.
Implementation Method 1
Cooling of these devices through use of boiling/vaporizing fluids has been identified as a suitable technique for cooling these devices
Implementation Method 2
a cooling plate in thermal communication with a heat exchanger, such that the cooled cooling fluid is to be cooled through transfer of heat into the heat exchanger
Data Source
AI summary
According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.