Inkjet Diffusion Soldering for Precise Semiconductor Die Joints
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Solution Overview
Problem
Current diffusion soldering techniques require expensive specialized equipment and are not well suited for forming precise geometries and ultrathin layers necessary in semiconductor manufacturing, limiting their applicability.
Innovation Solution
A method utilizing inkjet metal printing to form diffusion solderable regions between semiconductor dies and metal joining partners, allowing for precise control of solder composition and geometry, and forming soldered joints through diffusion soldering without mechanical pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If specialized equipment is used for diffusion soldering, then the process can be performed with established methods, but the cost increases and the ability to form precise geometries and ultrathin layers is limited
Solution Approach 1:
The patent replaces traditional mechanical diffusion soldering equipment with an inkjet printing system that uses digital control and material jetting to deposit solder paste. This substitution enables precise geometric control through software-driven droplet placement while eliminating the need for complex mechanical alignment and heating systems, directly resolving the contradiction between manufacturing precision and device complexity
Solution Approach 2:
The invention changes the fundamental parameters of the soldering process by using inkjet-deposited solder paste with controlled composition ratios (e.g., Sn-Ag-Cu alloys) and precise thickness control at the micrometer scale. This parameter transformation allows formation of ultrathin layers and complex geometries that are impossible with conventional thick solder deposits, achieving high manufacturing precision without requiring specialized equipment
2Adaptability or versatility
If conventional diffusion soldering techniques are used, then the process is established and reliable, but the cost is high and flexibility is reduced
Solution Approach 1:
The inkjet printing system serves multiple functions: it deposits solder paste, controls composition ratios, defines geometric patterns, and prepares the substrate for diffusion bonding all in a single integrated process. This multi-functionality replaces multiple specialized equipment and processes, increasing adaptability while reducing overall manufacturing cost through consolidation of operations
Solution Approach 2:
The invention uses digital design files to precisely copy and replicate solder patterns, geometries, and composition ratios across multiple substrates. This digital copying capability enables consistent reproduction of complex solder designs without requiring expensive custom tooling or equipment setup, thereby increasing flexibility while maintaining ease of manufacture
3Manufacturing precision
If traditional soldering methods are used, then the process is simple, but the ability to create connections in challenging locations is limited
Solution Approach 1:
The solder paste is segmented into individual droplets or micro-patterns that can be independently placed at precise locations on the substrate. This segmentation enables formation of solder connections in challenging locations such as narrow spaces between interconnect elements or on vertical surfaces, achieving high manufacturing precision while the printing process complexity is managed through software control rather than mechanical complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Inkjet metal printing enables cost-effective, flexible, and high-resolution formation of soldered joints with improved mechanical strength and thermal performance, suitable for precise semiconductor applications.
Implementation Method 1
forming a diffusion solderable region by an inkjet metal printing process
Implementation Method 2
Diffusion soldering involves on the formation of a soldered joint by diffusing different metals to form intermetallic phases
Data Source
Figure 1
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Figure 3A~3B
AI summary
A method of producing a semiconductor device includes providing a semiconductor die, providing a metal joining partner, forming a diffusion solderable region by an inkjet metal printing process, forming an assembly to include the diffusion solderable region in between the metal joining partner and the semiconductor die, and performing a diffusion soldering process that forms a soldered joint from the diffusion solderable region in between the semiconductor die and the metal joining partner.