Inkjet Encapsulating Composition for Thin OLED Moisture Barrier

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Solution Overview

Problem

Organic electronic devices, such as OLEDs, are sensitive to moisture and oxygen, leading to durability issues and a short lifespan due to external factors like humidity.

Innovation Solution

An encapsulating composition comprising an epoxy compound, a compound with an oxetane group, and a moisture adsorbent is developed. This composition is designed to form an organic layer that can be applied using an inkjet method, providing excellent spreadability and hardening strength while effectively blocking moisture and oxygen.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional sealing materials are used to block moisture and oxygen, then durability is improved, but device thickness increases and flexibility is reduced

Engineering Contradiction:

ImprovedurabilityVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent employs an organic encapsulation layer composed of flexible polymer materials that form thin film structures. This layer provides moisture and oxygen barrier properties while maintaining flexibility and minimizing thickness, replacing conventional rigid sealing materials that would increase device thickness and reduce flexibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The encapsulation composition uses composite material systems combining multiple polymer components with complementary properties. This composite approach achieves superior barrier performance against moisture and oxygen penetration while maintaining the thin-film structure needed for flexible, thin display devices.

Inventive Principle:

Principle #40Composite materials

2Reliability

If thick sealing layers are applied to ensure complete coverage and protection, then reliability is improved, but manufacturing complexity and production time increase

Engineering Contradiction:

Improvesealing effectivenessVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The encapsulation composition is formulated with optimized rheological properties including appropriate viscosity and surface tension characteristics. This preliminary formulation ensures that the material spreads uniformly and forms complete coverage at the intended thin thickness during the inkjet printing process, eliminating the need for multiple thick layers and reducing manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent optimizes physical parameters of the encapsulation composition including viscosity, surface tension, and curing characteristics. These parameter adjustments enable the material to be deposited as a uniform thin film through inkjet printing, achieving reliable sealing with reduced material thickness and simplified manufacturing processes.

Inventive Principle:

Principle #35Parameter changes

3Length of stationary object

If the encapsulation layer is made thinner to reduce device thickness, then device thickness is reduced, but barrier performance against moisture and oxygen deteriorates

Engineering Contradiction:

Improvedevice thicknessVSAvoidmoisture and oxygen penetration

Core Design Contradiction:

Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent employs composite polymer systems in the encapsulation layer that provide enhanced barrier properties per unit thickness. The composite material structure creates more tortuous diffusion paths for moisture and oxygen molecules, achieving superior barrier performance in thinner films compared to conventional single-material layers.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The encapsulation layer is designed as a specialized thin film with optimized molecular structure and composition. This thin film configuration maintains flexibility for thin display devices while incorporating barrier-enhancing features that effectively block moisture and oxygen penetration despite the reduced thickness.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulating composition effectively secures the lifetime of organic electronic devices by preventing moisture and oxygen penetration, enables top-emitting organic electronic devices, and allows for a thin display with improved durability and performance.

Implementation Method 1

an encapsulating composition for sealing an organic electronic element applicable to an inkjet process... comprising an epoxy compound, a compound having an oxetane group and a moisture adsorbent

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

The epoxy compound may be a photocurable or thermosetting compound... has excellent spreadability in a short time and has excellent hardening strength after curing

Methodology Applied

Scientific EffectPolymerization: Photopolymerisation

Data Source

PatentUS12202997B2Encapsulating composition

Publication Date: 2025.01.21 LG CHEM LTD

AI summary

An encapsulating composition and an organic electronic device comprising the same, and the encapsulating composition which is capable of effectively blocking moisture or oxygen penetrating into the organic electronic device from the outside to secure the lifetime of the organic electronic device, implementing a top-emitting organic electronic device, being applied in an inkjet method, and providing a thin display.