Inkjet Printed Phosphor Lattice for LED Light Extraction

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Solution Overview

Problem

Existing methods for forming lattice structures on phosphor layers in LED packages face challenges in achieving uniformity and precision, leading to light loss due to total reflection and complexity in manufacturing processes.

Innovation Solution

The method involves using an ink jet process to form lattice structures directly on a phosphor layer, allowing for precise control over the arrangement and height of phosphor dots, eliminating the need for conventional exposure processes and simplifying the manufacturing process by direct printing of phosphor-containing ink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional etching or photolithography is used to form lattice structures on phosphor layers, then light emitting efficiency is improved, but manufacturing complexity increases and uniformity/precision deteriorates

Engineering Contradiction:
Improvelight emitting efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical/chemical etching processes with a direct deposition method using an inkjet printer. Instead of using photo-sensitive polymers, UV irradiation, and chemical etching to form lattice structures, the invention directly deposits phosphor materials in lattice patterns through inkjet printing, eliminating complex manufacturing steps while maintaining light extraction efficiency

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the manufacturing approach from subtractive (etching) or complex multi-step processes to a direct additive deposition method. By controlling inkjet printing parameters such as droplet size, deposition density, and lattice geometry, precise and uniform lattice structures are formed without the complexity of conventional photolithography

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If conventional photolithography is used to form thin film-shaped phosphor lattice structures, then light emitting efficiency is improved, but light trapping due to total reflection increases

Engineering Contradiction:
Improvelight emitting efficiencyVSAvoidlight trapping
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent creates lattice structures with varying local geometries including protrusions and recesses that are optimized for light extraction. The inkjet deposition process allows different regions of the phosphor layer to have different lattice configurations, creating local optical pathways that reduce total internal reflection and improve light extraction efficiency

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention introduces three-dimensional lattice structures with vertical protrusions and recesses on the phosphor layer surface. This dimensional complexity creates multiple light extraction pathways and reduces the critical angle for total internal reflection, allowing light to escape more efficiently in multiple directions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If conventional methods are used to form lattice structures, then light extraction is improved, but manufacturing precision and uniformity deteriorate

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidlattice structure uniformity
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The patent replaces manual or complex photolithographic alignment processes with computer-controlled inkjet printing. The inkjet system uses digital patterning to deposit phosphor materials with precise control over lattice position, size, and uniformity, eliminating alignment errors and variability inherent in conventional methods

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention uses digital design files to precisely replicate the desired lattice pattern across the entire phosphor layer. The inkjet printing system copies the digital lattice template with high fidelity, ensuring uniformity and precision throughout the structure without the variability of manual or chemical processes

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a periodically uniform and precise lattice structure that enhances light extraction efficiency by minimizing total reflection and simplifies the manufacturing process, improving the overall light emitting efficiency of LED packages.

Implementation Method 1

forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS7795055B2Method of manufacturing light emitting diode package
Publication Date: 2010.09.14 SAMSUNG ELECTRONICS CO LTD
  • US7795055B2 patent drawing
  • US7795055B2 patent drawing
  • US7795055B2 patent drawing

AI summary

There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.