Inkjet Printer Assembly for 3D Electronic EMI Shielding
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Solution Overview
Problem
Inkjet printers used for depositing conductive ink on three-dimensional electronic devices, such as SIP modules, face challenges in achieving high throughput and efficient EMI shielding due to the need for uniform deposition on non-parallel surfaces and the limitations of traditional metal housings.
Innovation Solution
An inkjet printer assembly with multiple processing lines, each comprising a printing section and a sintering section, along with a transport mechanism, allows for the movement of electronic devices between these sections, enabling efficient deposition and sintering of a conductive ink layer with a crystal lattice structure, which forms a continuous EMI shield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal housing is used for EMI shielding, then EMI protection is achieved, but the device size increases and miniaturization objective is compromised
Solution Approach 1:
The patent applies this principle by replacing the traditional metal housing with a thin functional layer deposited directly on the surface of the SIP module. This functional layer, formed by sintering inkjet-printed conductive ink, provides EMI shielding while maintaining the compact size of the device, thus resolving the contradiction between EMI protection and device miniaturization
Solution Approach 2:
The patent changes the physical and chemical parameters of the shielding material by using conductive ink that can be printed and sintered to form a continuous conductive network. This transformation from bulk metal to a thin sintered layer with controlled porosity and conductivity achieves EMI shielding with minimal thickness, addressing the volume constraint
2Reliability
If inkjet ink is printed and sintered to form a continuous functional layer, then EMI shielding is achieved, but the processing time and throughput are limited
Solution Approach 1:
The patent divides the processing system into multiple independent processing lines, each capable of printing and sintering simultaneously. This segmentation allows parallel processing of multiple devices, significantly increasing throughput while maintaining the quality of continuous functional layer formation in each line
Solution Approach 2:
The patent implements continuous operation by having multiple processing lines work simultaneously and by designing the system to allow uninterrupted printing and sintering processes. The transport mechanism ensures continuous movement of devices through the processing lines, eliminating idle time and maximizing productivity
3Productivity
If multiple processing lines are implemented to increase throughput, then productivity is improved, but the device complexity and system cost increase
Solution Approach 1:
The patent applies this principle by designing the processing lines to be identical and interchangeable, with each line capable of performing the complete printing and sintering process. This universality allows the system to handle multiple devices simultaneously using the same proven technology, increasing throughput without proportionally increasing system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-throughput inkjet printing with efficient EMI shielding, allowing for continuous operation during the sintering process by enabling simultaneous printing on multiple devices, thereby increasing overall efficiency and throughput.
Implementation Method 1
a sintering section spaced apart from the first printing section and configured to sinter the functional layer on the surface of the electronic device, wherein the sintered functional layer exhibits a crystal lattice structure
Data Source
AI summary
The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.