Inlay PCB with Embedded Coin for Thermal Management
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Solution Overview
Problem
Current embedded coin production for printed circuit boards (PCBs) in high frequency applications is costly due to the extensive use of high frequency material in a full panel hybrid configuration.
Innovation Solution
Configuring the high frequency portion of the PCB as an inlay within the dielectric laminate, using a thermally-conductive coin embedded in dielectric core layers, with high frequency material only applied in specific areas for signal transfer, reducing the overall use of high frequency laminate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a full panel of high frequency material is used in hybrid configuration with dielectric material, then thermal conductivity is improved, but manufacturing cost increases significantly
Solution Approach 1:
The high frequency material is segmented into discrete coins placed only at specific locations where heat generation occurs, rather than using a full panel. This segmentation allows thermal management functionality to be concentrated where needed while reducing overall material consumption and cost.
Solution Approach 2:
The patent applies local quality by placing high frequency material coins only in specific regions of the PCB where high frequency signals are transmitted and heat is generated. The dielectric material is used in non-critical areas, creating a hybrid structure that optimizes both thermal performance and cost efficiency by matching material properties to functional requirements.
2Reliability
If high frequency material is used throughout the entire PCB panel, then signal transfer capability is improved, but manufacturing cost increases
Solution Approach 1:
The high frequency material is divided into individual coins placed only in regions requiring high frequency signal transfer. This segmentation maintains signal integrity where needed while eliminating unnecessary material usage in areas where high frequency performance is not required, thereby reducing cost.
Solution Approach 2:
The patent implements local quality by using high frequency material coins only in specific locations where high frequency signals are routed. The dielectric material is used in areas where standard signal transfer is sufficient. This localized application of materials maintains reliability for high frequency applications while reducing overall material cost.
3Temperature
If thermally-conductive coins are embedded in dielectric layers, then thermal management is improved, but manufacturing complexity increases
Solution Approach 1:
The high frequency material coins are prepared and positioned in advance during the PCB manufacturing process, before final assembly. The coins are placed on the dielectric layers and then laminated together, integrating the thermal management function into the base PCB structure rather than adding it as a separate post-processing step, thereby reducing overall manufacturing complexity.
Solution Approach 2:
The patent merges the thermal management function with the base PCB structure by embedding the high frequency material coins directly into the dielectric layers during lamination. This integration combines the structural, electrical, and thermal management functions into a single unified component, eliminating the need for separate thermal management assemblies and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces manufacturing costs by minimizing the amount of high frequency material used while maintaining effective thermal conductivity and signal transfer capabilities, with improved board stability and reduced warpage compared to non-inlay designs.
Implementation Method 1
Some PCBs employ embedded metal coins in order to remove the large amounts of heat generated by the electronic components, particularly in high frequency applications
Data Source
AI summary
A printed circuit board comprising: a plurality of dielectric core layers comprising at least a top dielectric core layer and a bottom dielectric core layer; a thermally-conductive coin embedded in at least one of the dielectric core layers; and a high frequency material inlaid in at least one of the dielectric core layers.