Inorganic-Core Package Structure With Embedded Organic Boards
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Solution Overview
Problem
Conventional approaches for forming component carrier-type packages face challenges in achieving mechanical robustness and electrical reliability, particularly under harsh conditions, with increasing miniaturization and complexity of components and connections.
Innovation Solution
A package architecture is developed comprising an inorganic core with through holes, embedded organic boards, and electrically conductive vertical connections, establishing a short connection path between opposing sides, using an inorganic core as a mechanical base and organic boards for electrical interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional approaches are used for forming component carrier-type packages, then manufacturing simplicity is maintained, but mechanical robustness and electrical reliability deteriorate under harsh conditions
Solution Approach 1:
The package employs a hybrid structure combining an inorganic core (ceramic or glass) with organic boards (PCB materials). This composite construction leverages the mechanical strength and thermal stability of inorganic materials while utilizing the electrical interconnection capabilities of organic boards, thereby achieving both mechanical robustness and electrical reliability without excessive complexity
Solution Approach 2:
The package is divided into distinct functional segments: an inorganic core providing mechanical support and thermal management, organic boards providing electrical interconnection, and through-holes providing vertical connectivity. This segmentation allows each component to be optimized for its specific function while contributing to overall reliability
2Productivity
If miniaturization of components and increasing number of connections are implemented, then component functionality is enhanced, but spacing between contacts decreases and manufacturing difficulty increases
Solution Approach 1:
The package utilizes vertical through-holes penetrating the inorganic core to establish electrical connections between organic boards stacked in the vertical dimension. This three-dimensional interconnection approach allows high connection density without reducing horizontal contact spacing, thereby maintaining manufacturing precision while enhancing functionality
3Reliability
If inorganic core with embedded organic boards is used, then thermal and electrical reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
Through-holes are pre-formed in the inorganic core before embedding the organic boards. This preliminary action allows for precise positioning and alignment of the organic boards within the inorganic structure, simplifying the overall manufacturing process while ensuring high thermal and electrical reliability
Data Source
AI summary
A package includes an inorganic core having at least one through hole, and at least one organic board with an at least partially organic dielectric matrix and at least one electrically conductive vertical through connection extending vertically through the at least partially organic dielectric matrix. The at least one organic board is at least partially embedded in the at least one through hole, and an electric connection between a top side and a bottom side of the inorganic core is established by the at least one vertical through connection.