Inorganic White Insulating Layer for LED Heat Dissipation
Solution Overview
Problem
LED illumination modules face challenges with heat dissipation due to organic material-based insulating layers, which have poor thermal conductivity, durability, and are susceptible to discoloration, especially when using high-density LED chips that generate significant heat.
Innovation Solution
A multilayer structure of an inorganic white insulating layer and a metal layer is formed using a liquid material containing white inorganic pigment and silicon dioxide nanoparticles, applied via ink jet, dispenser, or spray coating methods, providing superior heat endurance and adhesion, thus replacing traditional organic insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic material-based insulating layers are used in LED illumination modules, then ease of manufacture is improved, but heat dissipation performance deteriorates due to poor thermal conductivity
Solution Approach 1:
The patent applies composite materials by combining inorganic materials (such as ceramic substrates, metal layers, or inorganic insulating layers) with organic materials to create a hybrid structure. The inorganic components provide high thermal conductivity for effective heat dissipation, while the organic components maintain ease of manufacture and processing. This composite approach resolves the contradiction by integrating the thermal management benefits of inorganic materials with the manufacturing advantages of organic materials.
Solution Approach 2:
The patent employs parameter changes by modifying the thermal conductivity parameter of the insulating layer through material selection and structural design. By transitioning from purely organic materials to inorganic or composite materials with higher thermal conductivity parameters, the patent achieves improved heat dissipation performance while maintaining manufacturing feasibility through controlled parameter optimization.
2Ease of manufacture
If organic material-based insulating layers are used, then ease of manufacture is improved, but durability deteriorates due to discoloration and deterioration from ultraviolet rays and long-term use
Solution Approach 1:
The patent uses composite materials combining inorganic and organic layers where the inorganic layer (such as ceramic or metal oxide) provides UV resistance and long-term stability, while the organic layer maintains manufacturing ease. This composite structure protects against discoloration and deterioration by using UV-resistant inorganic materials as protective barriers.
Solution Approach 2:
The patent applies this principle by using thin, inexpensive organic insulating layers that are easily replaceable, combined with durable inorganic protective layers. The organic layer can be manufactured cheaply and replaced if needed, while the inorganic layer provides long-term durability and UV protection, effectively separating the disposable manufacturing-friendly component from the durable protective component.
3Illumination intensity
If high-density LED chips are used to achieve high brightness, then illumination intensity is improved, but heat generation increases causing component deterioration
Solution Approach 1:
The patent replaces traditional mechanical or organic heat management systems with inorganic thermal management structures such as ceramic substrates, metal heat sinks, or inorganic thermal conductive layers. These inorganic structures provide superior thermal conductivity and heat dissipation capabilities, effectively managing the heat generated by high-density LED chips while maintaining the high brightness output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of high-brightness, compact, and lightweight LED illumination apparatus with enhanced heat dissipation, eliminating the need for separate reflection members and reducing manufacturing costs while maintaining high thermal conductivity.
Implementation Method 1
A multilayer structure of an inorganic white insulating layer and a metal layer is formed using a liquid material containing white inorganic pigment and silicon dioxide nanoparticles, applied via ink jet, dispenser, or spray coating methods
Implementation Method 2
heat dissipation performance of an organic material is generally about 0.3 w/m · k and is inferior to that of an inorganic material (e.g. about 0.3 w/m · k of an organic material, about 1.5 w/m · k of silicon dioxide (SiO2), about 8 w/m · k of titanium dioxide, and about 50 w/m · k of zinc oxide)
Data Source
Figure 1~2
Figure 3~4
Figure 5~6(c)
AI summary
[Problem] An LED illumination apparatus is provided which has high brightness and emits a great amount of light, and which is compact and lightweight. [Solution] An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm2/cm2 or more. An LED illumination apparatus including the LED illumination module is also provided.