Inorganic Packaging Module for High-Power LED Thermal Management
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Solution Overview
Problem
Conventional packaging modules using organic materials like PPA or EMC become brittle and fail under ultraviolet light exposure, leading to air-tight and water-proof issues, and are inadequate for high-power LED applications due to heat conduction limitations and material incompatibilities.
Innovation Solution
An inorganic packaging module with a substrate, frame, and transparent quartz cover, using inorganic metal layers for secure connections and heat conduction, featuring a substrate with a titanium and patterned copper layer, and a frame made of materials like AlN or SiC, with Au and Ni layers for bonding, ensuring compatibility and preventing moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic materials like PPA or EMC are used for packaging modules, then ease of manufacture is improved, but reliability deteriorates under ultraviolet light exposure due to material brittleness and cracking
Solution Approach 1:
The patent changes the material composition parameters from organic (PPA/EMC) to inorganic (quartz, AlN, SiC), fundamentally altering the material properties to resist UV degradation while maintaining manufacturability through established ceramic processing techniques
Solution Approach 2:
The patent employs composite material structures combining quartz substrates with metal layer systems (Al, Cu, Au, Ni) and inorganic bonding agents, creating a multi-layer composite that leverages the advantages of each material for enhanced UV resistance and structural integrity
2Ease of manufacture
If conventional packaging modules are used with frit bonding, then ease of manufacture is improved, but reliability deteriorates due to separation between substrate and lead-frame under ultraviolet light
Solution Approach 1:
The patent changes the bonding agent from organic frit to inorganic bonding materials, altering the chemical composition to prevent UV-induced degradation and separation while maintaining bonding effectiveness through ceramic-compatible processes
Solution Approach 2:
The patent replaces the conventional frit bonding approach with a more durable inorganic bonding system that eliminates the need for frequent replacement due to UV degradation, effectively treating the bonding interface as a long-lasting component
3Illumination intensity
If light tubes are used for ultraviolet light emission, then illumination intensity is improved, but loss of energy increases due to heat transformation
Solution Approach 1:
The patent introduces an inorganic packaging structure with enhanced thermal conduction properties as an intermediary system that manages heat transformation more efficiently, reducing energy loss while maintaining UV output through improved thermal pathways
Solution Approach 2:
The patent replaces the conventional light tube system with LED technology, substituting one emission mechanism with another that inherently produces less waste heat, thereby reducing energy loss while maintaining illumination intensity
4Device complexity
If conventional packaging modules are used for high-power LEDs, then device complexity is reduced, but heat conduction capability deteriorates
Solution Approach 1:
The patent changes the thermal conduction parameters of the packaging module by using inorganic materials with superior thermal properties (quartz, AlN, SiC) compared to conventional organic materials, enabling effective heat dissipation for high-power LEDs
Solution Approach 2:
The patent segments the packaging module into distinct functional layers (substrate, bonding layers, encapsulation) with each layer optimized for specific thermal management functions, allowing systematic heat conduction pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inorganic packaging module provides enhanced heat conduction, maintains air-tightness, and prevents moisture damage, supporting high-power LEDs by ensuring compatible thermal expansion and secure connections between components.
Implementation Method 1
using inorganic metal layers for secure connections and heat conduction
Implementation Method 2
a transparent cover on top of the frame to enclose the chip inside the packaging module
Data Source
AI summary
A packaging module includes a substrate, a chip firmly mounted on the substrate, a frame firmly connected to the substrate via a gold-to-gold bonding and a cover firmly connected to the frame via the same gold-to-gold bonding. With the inorganic bonding structure, the packaging module is able to endure high temperature and high pressure without the worry of bonding agent being damaged by environmental condition change.