Inorganic Dielectric Passive Device Integration in 3D IC Packages
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Solution Overview
Problem
As integrated circuit packages become increasingly complex with multiple device dies packaged together, there is a need for efficient integration of passive devices within these structures to optimize performance and reduce manufacturing costs, while avoiding the use of organic dielectric materials that can cause warpage and CTE mismatch issues.
Innovation Solution
The integration of passive devices such as capacitors, inductors, and resistors within the package structure, using hybrid bonding and gap-filling techniques, along with the formation of through-vias and shielding structures to electrically connect and isolate these devices, allowing for direct metal-to-metal and dielectric-to-dielectric bonding without organic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic dielectric materials are used in package structures, then ease of manufacture is improved, but warpage and CTE mismatch issues occur worsening manufacturing precision and reliability
Solution Approach 1:
The patent removes organic dielectric materials from the package structure and replaces them with inorganic dielectric materials. This extraction of the problematic organic material eliminates the root cause of warpage and CTE mismatch while maintaining the manufacturing processability through alternative inorganic materials that can be deposited using standard semiconductor fabrication techniques.
Solution Approach 2:
The patent changes the material parameter from organic to inorganic dielectric materials. This parameter change fundamentally alters the thermal and mechanical properties of the package structure, eliminating CTE mismatch issues and warpage while allowing for precise control of dielectric properties through material composition and layer thickness adjustments.
2Device complexity
If passive devices are integrated within package structures, then device complexity is reduced and manufacturing cost decreases, but integration precision and electrical isolation requirements increase
Solution Approach 1:
The patent merges passive devices (capacitors, inductors, resistors) directly into the package structure by forming them within the same inorganic dielectric layers that provide structural support and electrical isolation. This integration eliminates the need for separate SMD components and their associated mounting processes, reducing overall device complexity while maintaining precise electrical characteristics through controlled material properties.
Solution Approach 2:
The inorganic dielectric layers serve as an intermediary medium that simultaneously provides structural support, electrical isolation, and a formation medium for passive devices. This intermediary material enables precise control over the electrical properties and physical dimensions of integrated passive devices while maintaining the structural integrity of the package.
3Reliability
If through-vias and shielding structures are formed, then electrical connection and isolation are improved, but manufacturing steps and process complexity increase
Solution Approach 1:
The patent performs preliminary formation of through-vias and shielding structures during the same dielectric layer deposition and patterning processes that create the passive devices. By integrating these features into the same manufacturing sequence, the patent achieves reliable electrical connections and isolation without adding separate process steps, thereby maintaining manufacturing efficiency.
Solution Approach 2:
The inorganic dielectric layers and metal patterns serve multiple functions simultaneously: they provide structural support, electrical isolation, passive device formation, through-via formation, and shielding. This multi-functionality reduces the need for separate dedicated structures and processes, simplifying the overall manufacturing process while achieving all necessary electrical connection and isolation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for Surface-Mount Devices (SMDs), reduces manufacturing costs, enhances design flexibility, and improves routing ability and fine-pitch metal line formation by minimizing CTE mismatch and warpage, while enabling efficient electrical connection and interference shielding.
Implementation Method 1
bonding a first device die with a second device die to form a combined structure
Implementation Method 2
filling a gap between the first device die and the second device die with a gap-filling material
Implementation Method 3
performing a planarization to reveal the second device die
Implementation Method 4
forming a through-via penetrating through the isolation region to electrically couple to the first device die
Implementation Method 5
forming a shielding structure over the second device die and the isolation region
Data Source
AI summary
A method includes bonding a first device die with a second device die. The second device die is over the first device die. A passive device is formed in a combined structure including the first and the second device dies. The passive device includes a first and a second end. A gap-filling material is formed over the first device die, with the gap-filling material including portions on opposite sides of the second device die. The method further includes performing a planarization to reveal the second device die, with a remaining portion of the gap-filling material forming an isolation region, forming a first and a second through-vias penetrating through the isolation region to electrically couple to the first device die, and forming a first and a second electrical connectors electrically coupling to the first end and the second end of the passive device.