Insert Molded Circuit Insulator Segmentation

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Solution Overview

Problem

Insulators produced by insert molding with integrally connected conductor forming members are prone to forming unintended circuits due to gaps between conductors, which can lead to malfunctions from frosting or foreign substance accumulation.

Innovation Solution

The solution involves creating multiple gaps between conductors by removing sections of the connecting part of the terminal forming member during the insert molding process, with additional wall parts to isolate these gaps and prevent simultaneous frosting or dust accumulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If gaps are formed between conductors by removing connecting part sections, then unintended circuit formation is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improveunintended circuit preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connecting part is divided into multiple sections by forming gaps at predetermined positions. This segmentation isolates conductors from each other, preventing unintended circuits while maintaining the overall structure. The gaps create independent sections that cannot simultaneously form conductive paths between different conductors.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Sections of the connecting part are removed to create gaps between conductors. By extracting material from specific locations in the connecting part, the patent eliminates potential conductive paths that could cause unintended circuits, while preserving the structural integrity of the remaining connecting sections.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If multiple gaps are formed between conductors, then probability of simultaneous frosting or dust accumulation is reduced, but structural complexity increases

Engineering Contradiction:
Improvemalfunction probability reductionVSAvoidinsulator structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulator structure is segmented into multiple independent zones by forming gaps between conductors. Each gap creates an isolated space that must independently accumulate frost or dust to cause a malfunction. The probability of simultaneous accumulation in multiple gaps is extremely low, thereby improving reliability without requiring complex active protection systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces spatial separation through gaps in the connecting part, creating dimensional isolation between conductors. This spatial arrangement in three-dimensional space effectively reduces the probability of simultaneous contamination events by distributing potential failure points across different locations and planes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP2853442B1Insert molded circuit and method of producing an insert molded circuit
Publication Date: 2017.08.02 KK TOKAI RIKA DENKI SEISAKUSHO
  • EP2853442B1 patent drawingFigure 1
  • EP2853442B1 patent drawingFigure 2
  • EP2853442B1 patent drawingFigure 3

AI summary

An insulator 1 is obtained by insert molding a conductor forming member 4 in which a plurality of conductor forming parts 5,6 for forming conductors are integrally connected by a connecting part 7, and thereafter, by removing a plurality of parts of the connecting part 7. A plurality of gaps 10, 11 are formed in the connecting part 7. The connecting part 7 is divided into a plurality of connecting portions by the plurality of gaps 10, 11 so that the plurality of connecting portions are electrically separated to each other.