Thermally Insulated Cooling Surfaces for Power Module Heat Management
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Solution Overview
Problem
Power modules with electronic control cards are vulnerable to high temperatures due to heat emitted by electrical equipment, leading to reduced lifespan and requiring costly temperature adaptation technologies.
Innovation Solution
A power module configuration with thermally insulated cooling surfaces, where electrical equipment is in contact with one surface and electronic cards are connected to the other surface via a heat sink, utilizing thermally conducting materials and insulating elements to manage heat dissipation and protect cards from thermal radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic cards are positioned close to pieces of electrical equipment for compact design, then device complexity is reduced, but the electronic cards are exposed to high temperatures reducing their lifespan
Solution Approach 1:
The cooling device is divided into two thermally insulated surfaces: a first surface in thermal contact with heat-generating electrical equipment and a second surface for cooling electronic cards. This segmentation allows the same cooling device to serve dual purposes while preventing thermal coupling between hot and cold zones, thereby extending electronic card lifespan without increasing module complexity.
Solution Approach 2:
A thermally insulating wall or barrier is introduced between the electronic cards and the hot electrical equipment. This intermediary structure deflects infrared radiation and blocks heat transfer pathways, protecting the electronic cards from thermal exposure while allowing compact positioning near the electrical equipment.
2Reliability
If expensive high-temperature resistant card technology is used, then electronic cards can withstand high temperatures, but manufacturing cost increases
Solution Approach 1:
The cooling device pre-cools the electronic cards before they are exposed to the hot environment by positioning them in thermal contact with the second (cold) surface. This preliminary cooling action allows the use of standard, less expensive electronic card technologies that would otherwise be damaged by high temperatures, eliminating the need for costly high-temperature resistant components.
Solution Approach 2:
The heat generated by the electrical equipment, which would normally be harmful to electronic cards, is converted into a beneficial cooling source. The cooling device captures heat from the electrical equipment and redirects it to cool the electronic cards via the thermally insulating barrier, turning the harmful thermal radiation into a useful cooling mechanism.
3Device complexity
If a single cooling surface is used for both electrical equipment and electronic cards, then device complexity is reduced, but thermal interference occurs reducing cooling efficiency
Solution Approach 1:
The cooling device is segmented into two distinct thermally insulated surfaces: a first surface that absorbs heat from electrical equipment and a second surface that provides cooling to electronic cards. This segmentation prevents thermal interference while maintaining a unified cooling device structure, ensuring optimal cooling efficiency for both components without requiring separate cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively extends the lifespan of electronic cards by efficiently managing heat dissipation and reducing exposure to high temperatures, using less expensive technologies while maintaining module functionality.
Implementation Method 1
the pieces of electrical equipment being in thermal contact with the first surface... the first electronic card being thermally connected to the second surface of the cooling device by a heat sink
Implementation Method 2
the cooling devices include first and second surfaces thermally insulated from one another... a strip of thermally insulating material, separating said first and second surfaces
Implementation Method 3
ventilation fins, fastened to a second face of the cooling panel
Implementation Method 4
a face of the thermally insulating wall, oriented toward the piece of electrical equipment, is covered by a layer of material deflecting infrared radiation
Implementation Method 5
a thermal contact between the first electronic card and the first end of the heat sink is provided by a layer of thermally conductive paste or foam
Data Source
AI summary
The application relates to a power module (10) including: pieces of electrical equipment (12), at least first (14) and second (16) electronic cards, and a cooling device (20), able to discharge the heat given off by the pieces of electrical equipment and electronic cards. The cooling devices include first (34) and second (36) surfaces thermally insulated from one another, the pieces of electrical equipment (12) being in thermal contact with the first surface and separated from the second surface. The first electronic card (14) is fastened to a piece of electrical equipment (12) and thermally connected to the second surface (36) of the cooling device by a heat sink (42). The second electronic card (16) is positioned close to the second surface (36), or in contact with the second surface.