Insulating Case Microhole Machining for Arc Discharge Prevention
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Solution Overview
Problem
The existing semiconductor manufacturing apparatus faces challenges in machining microholes to improve communication between the wafer placement surface and the porous plug, leading to difficulties in reducing the length of microholes and preventing arc discharge.
Innovation Solution
A member for semiconductor manufacturing apparatus is designed with a ceramic plate, a conductive substrate, a dense insulating case with microholes, and a porous plug, where the insulating case is separate from the ceramic plate, allowing for improved machinability and positioning of microholes to maintain a low height between the wafer rear surface and the porous plug, preventing arc discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If microholes are provided directly in the ceramic plate, then the wafer placement surface can communicate with the porous plug, but the machinability of microholes deteriorates and the length of microholes cannot be reduced
Solution Approach 1:
The patent divides the original single-component structure into multiple components: a ceramic plate and a separate insulating case with microholes. This segmentation allows the microholes to be machined in the insulating case independently, improving machinability and enabling precise control of microhole length without affecting the ceramic plate's integrity.
Solution Approach 2:
The insulating case acts as an intermediary component between the ceramic plate and the porous plug. It provides a platform for forming microholes with controlled length that can communicate the wafer placement surface with the porous plug, while also serving as an insulating barrier.
2Reliability
If the height of the space between the wafer rear surface and the porous plug is reduced to prevent arc discharge, then the reliability improves, but the machining of microholes with appropriate length becomes more difficult
Solution Approach 1:
By separating the microhole formation from the ceramic plate and placing it in the insulating case, the patent enables independent optimization of microhole length to control the space height, thereby preventing arc discharge while maintaining ease of manufacture.
Solution Approach 2:
The patent changes the material parameter from ceramic to insulating material for the microhole-containing component, allowing for easier machining and precise control of microhole length, which directly controls the space height between wafer and porous plug to prevent arc discharge.
3Device complexity
If the insulating case is integrated with the ceramic plate, then the device complexity is reduced, but the positioning precision of the insulating case deteriorates
Solution Approach 1:
The patent maintains separation between the ceramic plate and insulating case, allowing each component to be manufactured and positioned independently with high precision, rather than integrating them which would complicate positioning.
Solution Approach 2:
The insulating case is designed to be self-positioning through its interaction with the first hole structure, where the case automatically aligns and positions itself during assembly, eliminating the need for complex external positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the machinability of microholes, reduces the risk of arc discharge, and ensures efficient gas flow to the wafer rear surface, improving the overall performance of the semiconductor manufacturing process.
Implementation Method 1
a porous plug disposed in the bottomed hole and in contact with the bottom
Implementation Method 2
a plurality of microholes penetrating a bottom of the bottomed hole in an up-down direction
Implementation Method 3
a dense insulating case that has a bottomed hole opened in a lower surface, and is disposed in the first hole and the second hole
Implementation Method 4
an electrostatic chuck having a wafer placement surface
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes: a ceramic plate; a metal joining layer and a cooling plate (conductive substrate) provided at a lower surface of the ceramic plate; a first hole penetrating the ceramic plate in an up-down direction; and a through-hole and a gas hole (second hole) penetrating the conductive substrate in an up-down direction, and communicating with the first hole. A dense insulating case has a bottomed hole 64 opened in a lower surface, and is disposed in the first hole and the second hole. A plurality of microholes penetrates a bottom of the bottomed hole in an up-down direction. A porous plug is disposed in the bottomed hole and in contact with the bottom.