Insulating Heat Dissipation Coating Composition

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Solution Overview

Problem

Existing insulating heat dissipation coatings face challenges in achieving both excellent thermal conductivity and emissivity, while maintaining adhesive strength, durability, and surface quality, particularly in electronic devices where both insulation and heat dissipation are required.

Innovation Solution

A composition comprising a curable resin, insulating heat dissipation fillers like silicon carbide, and specific curing agents, which form a coating layer with enhanced thermal emissivity, adhesive strength, and uniform dispersibility, ensuring effective heat dissipation and insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat dissipation fillers with high thermal conductivity are used in the coating layer, then heat dissipation performance is enhanced, but electrical insulation property deteriorates

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidelectrical conductivity

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent uses a composite filler system combining aluminum oxide particles (providing thermal conductivity) with insulating organic compounds (providing electrical insulation). This composite approach allows the coating to achieve both heat dissipation and electrical insulation properties simultaneously, resolving the contradiction between thermal conductivity and electrical insulation.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent optimizes the particle size distribution and concentration of aluminum oxide fillers within specific ranges (0.1-10 μm, 1-50 wt%) to achieve optimal balance between thermal conductivity and electrical insulation. By carefully controlling these parameters, the coating achieves both heat dissipation performance and electrical insulation property.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If insulating heat dissipation coating layer is formed to achieve both insulating and heat dissipation properties, then functional performance is improved, but surface quality deteriorates due to uneven or filler-protruding surface

Engineering Contradiction:

Improveinsulating and heat dissipation propertiesVSAvoidsurface quality

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent controls the particle size distribution of fillers (D50/D97 ratio of 1:4.5 or less) and their concentration in the coating composition to prevent filler protrusion and achieve a smooth, uniform surface. This parameter optimization maintains both functional properties and surface quality.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a resin matrix with specific viscosity and flow characteristics that locally adapts to the filler distribution, ensuring uniform embedding of particles and a smooth surface finish. The resin composition (including specific ratios of monomers and catalysts) creates a homogeneous matrix that prevents surface defects.

Inventive Principle:

Principle #3Local quality

3Temperature

If heat dissipation coating layer with high thermal conductivity is formed, then heat dissipation performance is enhanced, but thermal emission to outside deteriorates due to low thermal emissivity at interface

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidthermal emission

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The patent combines inorganic heat dissipation fillers (aluminum oxide) with organic resin matrices that provide thermal emission capabilities. This composite structure enables both heat conduction through the filler network and thermal radiation from the coating surface, resolving the contradiction between heat dissipation performance and thermal emission.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a coating layer with improved thermal emissivity, adhesive strength, and durability, enabling efficient heat dissipation and insulation, suitable for various electronic components.

Implementation Method 1

an insulating heat dissipation filler having both an insulating property and a heat dissipation property

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

have, particularly, excellent thermal emissivity

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS11805625B2Insulating heat dissipation coating composition and insulating heat dissipation unit formed using the same

Publication Date: 2023.10.31 AMOGREENTECH CO LTD

AI summary

An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed.