Inorganic Insulating Layer Thickness Variation for Flexible Display Stress Management
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Solution Overview
Problem
The existing flexible display technologies face issues with crack formation and wire disconnection due to the hard inorganic insulating layer cracking when the resin substrate is twisted or distorted, and the removal of the base film between wires leads to stress concentration and further crack formation.
Innovation Solution
The implementation of an inorganic insulating layer with a continuous first portion over wires and a thinner, second portion between adjacent wires, which is either formed thinner than the first portion or avoids part of the second region, to disperse stress and prevent crack formation and wire disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a base film including an inorganic insulating layer is formed on the resin substrate to prevent contamination and improve adhesion, then adhesion between wire and substrate is improved, but the inorganic insulating layer cracks when the resin substrate is twisted or distorted
Solution Approach 1:
The inorganic insulating layer is formed with different thicknesses in different regions: a first thickness in regions under wires and a second thickness ( thinner than the first) in regions between wires. This local quality variation allows the layer to maintain adhesion where needed while reducing stress concentration in between-wire regions, preventing cracks during substrate distortion.
2Ease of manufacture
If the inorganic insulating layer is formed uniformly across the substrate, then manufacturing is simplified, but stress concentration occurs on particular wires when the resin substrate is twisted or distorted
Solution Approach 1:
The inorganic insulating layer is formed with a first thickness in regions under wires and a second thickness (thinner than the first) in regions between wires. This local thickness variation disperses stress during substrate distortion, preventing crack concentration on particular wires while maintaining manufacturing feasibility through selective formation processes.
Data Source
AI summary
Layers on a resin substrate in a peripheral area include wires extending in a wiring direction, and an inorganic insulating layer. The inorganic insulating layer is formed on first regions under the plurality of respective wires and on second regions each positioned between the adjacent first regions. The inorganic insulating layer includes a first portion on each first region. The inorganic insulating layer includes a second portion on each second region. The first portion is continuous in the wiring direction. The second portion is formed in at least either one of the manners such that the second portion is formed while avoiding a part of the second region on which the second portion is disposed or that the second portion is formed thinner than the first portion, and is continuous to the first portion adjacent to the second portion.