Insulating Member with Multi-Size Inorganic Fillers for Heat Radiation
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Solution Overview
Problem
Existing semiconductor modules with metal base substrates face limitations in heat radiation and breakdown strength, particularly at high current capacities, due to insufficient cooling properties and increased material costs, with fully molded modules experiencing insulation failures and deformation issues.
Innovation Solution
An insulating member with a blend of epoxy resin, first inorganic fillers (1-99 nm) and second inorganic fillers (0.1-100 μm) is used, providing a thermal conductivity of 4-15 W/m·K and breakdown voltage of at least 5 kV, integrated into a metal base substrate and semiconductor module, enhancing both heat radiation and breakdown strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the insulating layer is reduced to improve heat radiation, then the cooling property improves, but the breakdown strength decreases
Solution Approach 1:
The patent changes the particle size parameter of inorganic fillers by introducing a specific size distribution (0.1-10 μm main range with 1-100 nm fine particles), which fundamentally alters the insulating layer's thermal and electrical properties, achieving both high thermal conductivity and high breakdown strength simultaneously
Solution Approach 2:
The patent creates a composite insulating layer combining epoxy resin with multi-size inorganic filler particles (0.1-10 μm and 1-100 nm), where the composite structure achieves synergistic effects: the larger particles provide thermal conductivity pathways while the finer particles fill voids and enhance breakdown strength
2Temperature
If inorganic filler is loaded into epoxy resin to increase thermal conductivity, then the cooling property improves, but the breakdown voltage decreases
Solution Approach 1:
The patent fundamentally changes the particle size parameter of inorganic fillers by introducing a specific size distribution (0.1-10 μm main range with 1-100 nm fine particles), which fundamentally alters the insulating layer's thermal and electrical properties, achieving both high thermal conductivity and high breakdown strength simultaneously
Solution Approach 2:
The patent applies local quality by creating different filler concentrations and sizes in different regions of the insulating layer, with finer particles (1-100 nm) filling voids and enhancing breakdown strength in critical areas while larger particles (0.1-10 μm) provide thermal conductivity pathways
3Reliability
If molding resin injection pressure is raised to improve loadability and prevent insulation failure, then the insulation reliability improves, but the bonding wire may deform or disconnect
Solution Approach 1:
The patent performs preliminary action by pre-forming the insulating layer with optimized filler distribution and properties before the molding process, so that the insulating layer can maintain its structural integrity and electrical insulation properties without requiring excessive injection pressure that would damage bonding wires
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases breakdown strength while maintaining heat radiation capabilities, addressing the limitations of existing semiconductor modules by using a specific blend of inorganic fillers in the insulating member within the metal base substrate and semiconductor module.
Implementation Method 1
In the insulating layer 61 of the metal base substrate 60, thermal conductivity is increased by loading an inorganic filler (for example, silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, or boron nitride) into an epoxy resin
Implementation Method 2
a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 μm
Data Source
AI summary
An insulating member of the invention can include an epoxy resin, a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 μm. The first and second inorganic fillers can be independent of each other, and can be selected from a group including Al2O3, SiO2, BN, AlN, and Si3N4, and the blending ratios of the first and second inorganic fillers in the insulating member can be 0.1 to 7% by weight and 80 to 95% by weight respectively. A metal base substrate can be formed by forming a metal foil and a metal base on either surface of the insulating member.