Thermally Insulating Material for Semiconductor Package Heat Management
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Solution Overview
Problem
Conventional thermal management techniques for semiconductor devices often inadequately manage heat, leading to increased temperatures that can degrade or damage both the devices and nearby components, potentially causing performance issues or failure.
Innovation Solution
The use of thermally insulating materials is implemented to selectively cover the ends of semiconductor devices, creating thermal resistance and redirecting heat flow away from adjacent components, thereby maintaining operating temperatures within safe limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management techniques (heat sinks, thermal conduction paths) are used to conduct heat away from semiconductor devices, then heat dissipation is improved, but temperatures of adjacent components still increase due to heat spread through thermally conductive materials
Solution Approach 1:
The patent applies local quality by transitioning from uniform thermal management to localized thermal control. Thermally insulating material is selectively positioned only at specific locations where heat transfer to adjacent components occurs, rather than applying thermal management uniformly across the entire device. This localized approach prevents heat spread to sensitive areas while maintaining efficient heat dissipation from heat-generating regions through thermally conductive paths.
Solution Approach 2:
The patent uses thermally insulating material as an intermediary substance positioned between the heat-generating semiconductor device and adjacent components. This intermediary blocks the harmful heat transfer path while allowing the primary heat dissipation function to continue through separate thermally conductive pathways, thus mediating between heat source and sensitive components.
2Reliability
If thermally insulating material is added to block heat transfer, then protection of adjacent components is improved, but device complexity increases
Solution Approach 1:
The thermal management structure is segmented into distinct functional zones: thermally conductive paths for heat dissipation and thermally insulating regions for heat blocking. The insulating material is divided into specific segments positioned at precise locations where heat transfer needs to be blocked, rather than using a single complex thermal management component. This segmentation simplifies the overall design by creating modular, easily implementable thermal control zones.
3Temperature
If thermally conductive materials are used to manage heat, then heat dissipation from primary device is improved, but heat spread to adjacent devices increases
Solution Approach 1:
The patent implements local quality by creating spatially differentiated thermal properties within the package. Thermally conductive materials are positioned locally at the heat-generating primary device to maintain its operational temperature, while thermally insulating materials are positioned locally at interfaces to adjacent devices to prevent heat spread. This localized differentiation allows simultaneous optimization of heat dissipation and heat blocking functions.
Solution Approach 2:
The thermal management system is segmented into heat dissipation pathways and heat blocking barriers. Conductive materials form segmented pathways that channel heat away from the primary device, while insulating materials create segmented barriers at strategic locations to intercept and block heat before it reaches adjacent devices. This segmentation enables independent optimization of each thermal function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the maximum operational temperature of secondary semiconductor devices, preventing damage while allowing the primary device to maintain higher operational temperatures, thus enhancing thermal management and preventing component failure.
Implementation Method 1
at least one additional end of the second semiconductor device is covered with a thermally insulating material to resist flow of heat from the first semiconductor device to the second semiconductor device
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3C
AI summary
Semiconductor device packages comprise a first semiconductor device comprising a heat generating region located on at least one end thereof. A second semiconductor device is attached to the first semiconductor device. At least a portion of the heat generating region extends laterally beyond at least one corresponding end of the second semiconductor device. A thermally insulating material at least partially covers the end of the second semiconductor device. Methods of forming a semiconductor device packages comprise attaching a second semiconductor device to a first semiconductor device. The first semiconductor device comprises a heat generating region at an end thereof. At least a portion of the heat generating region extends laterally beyond an end of the second semiconductor device. The end of the second semiconductor device is at least partially covered with a thermally insulating material.