Insulating Sleeve Structure for Damage-Free Removal in Ceramic Base Plates
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Solution Overview
Problem
In semiconductor manufacturing apparatus members, the adhesive agent between the base plate through holes and the insulating sleeves deteriorates over time due to corrosion, making it difficult to remove the insulating sleeves without damaging the ceramic or base plates.
Innovation Solution
The member includes a ceramic plate with embedded electrodes, a conductive base plate, insulating sleeves with a tool engaging portion, and an adhesion layer. The tool engaging portion allows an external tool to transmit rotation torque, breaking the adhesion layer and enabling easy removal of the insulating sleeve.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If the adhesive agent between the base plate through holes and the insulating sleeves is used for long periods, then the adhesive agent deteriorates due to corrosion, but the insulating sleeves become difficult to remove without damaging the ceramic or base plates
Solution Approach 1:
The insulating sleeve is divided into two functional parts: the main body that adheres to the base plate through hole, and the tool engaging portion that extends into the through hole. This segmentation allows the tool engaging portion to be engaged by a removal tool without requiring force on the adhered portion, enabling easy removal while maintaining strong adhesion during service.
Solution Approach 2:
The tool engaging portion acts as an intermediary element between the insulating sleeve and the external removal tool. It provides a mechanical interface that allows torque transmission from the tool to the insulating sleeve, facilitating removal without directly applying force to the adhered portion that could cause damage.
2Reliability
If the insulating sleeves are removed and re-adhered to replace the adhesive agent, then the adhesive agent can be renewed, but the work of removing the insulating sleeves becomes highly difficult and may damage the ceramic plate or base plate
Solution Approach 1:
By segmenting the insulating sleeve into an adhered body and a removable tool-engaging portion, the design enables simple maintenance operations. The tool engaging portion can be engaged by a removal tool to rotate and break the adhesion layer without applying damaging forces to the ceramic plate or base plate.
Solution Approach 2:
The tool engaging portion is pre-configured within the insulating sleeve structure, allowing maintenance personnel to easily engage a removal tool and perform adhesion layer breaking through controlled rotation. This preliminary design feature prevents the need for complex removal procedures that could cause damage.
3Temperature
If the tool engaging portion is provided upward from the bottom surface of the refrigerant flow path, then the shape of the tool engaging portion may affect heat uniformity of the wafer, but the tool engaging portion is provided downward from the bottom surface of the refrigerant flow path, and accordingly the effects are reduced
Solution Approach 1:
The tool engaging portion is positioned in the vertical dimension below the refrigerant flow path rather than above it. This dimensional relocation allows the tool engaging portion to be accessed from the bottom side, maintaining heat uniformity on the wafer surface while providing easy accessibility for maintenance operations through the base plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the easy and damage-free removal of insulating sleeves, extending the lifespan of the semiconductor manufacturing apparatus member by avoiding the need for frequent replacement of the adhesive agent.
Implementation Method 1
an insulating sleeve, which is inserted into the base plate through hole and of which an outer peripheral surface is adhered to an inner peripheral surface of the base plate through hole via adhesion layers
Implementation Method 2
Rotating the external tool breaks the adhesion layer by rotation torque thereof
Data Source
AI summary
A member for a semiconductor manufacturing apparatus, includes: a ceramic plate that has a ceramic plate through hole; an electroconductive base plate that has a base plate through hole and that is disposed on a lower surface side of the ceramic plate; an insulating sleeve which is inserted into the base plate through hole and of which an outer peripheral surface is adhered to an inner peripheral surface of the base plate through hole via an adhesion layer; and a sleeve through hole that passes through the insulating sleeve in the up-down direction and that communicates with the ceramic plate through hole. The insulating sleeve has a tool engaging portion that is engageable with an external tool, and upon being engaged with the external tool, the tool engaging portion transmits rotation torque of the external tool to the insulating sleeve.