Insulation Layer Opening Deformation Prevention

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Solution Overview

Problem

Conventional manufacturing processes for organic insulation layers in liquid crystal panels often result in deformation of openings, leading to reduced resolution and clogging issues.

Innovation Solution

A method involving depositing an insulation layer on a substrate, exposing and developing it to create openings, followed by ultraviolet light curing and high-temperature annealing to enhance crosslinking and prevent deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high-temperature annealing treatment is performed on the insulation layer after opening formation, then the insulation layer quality is improved, but the opening deforms and gets blocked

Engineering Contradiction:
Improveinsulation layer qualityVSAvoidopening shape
Core Design Contradiction:
Manufacturing precisionVSShape

Solution Approach 1:

The patent applies a preliminary action by performing light curing on the insulation layer before the high-temperature annealing treatment. This pre-curing step creates a crosslinked structure that provides thermal stability and prevents the opening from deforming during the subsequent high-temperature annealing process, thus allowing the annealing to improve insulation layer quality without compromising opening shape

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical-chemical parameter of the insulation layer by introducing a light-curing step that creates crosslinking. This parameter change (from uncured to crosslinked state) increases the thermal resistance of the insulation layer, enabling it to withstand high-temperature annealing without deformation while still achieving the desired quality improvement

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If conventional manufacturing process is used for insulation layer, then the process is simple, but the opening deforms and resolution decreases

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidopening resolution
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent introduces a preliminary light-curing action before the annealing treatment. This additional step, while increasing process complexity slightly, prevents opening deformation and maintains high resolution, thereby achieving improved manufacturing precision that justifies the added process step

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces the likelihood of deformation and clogging during high-temperature annealing, improving the quality and resolution of the insulation layer and subsequently the array substrate.

Implementation Method 1

light curing the insulation layer having the opening; adopting an ultraviolet light to light curing the insulation layer having the opening

Methodology Applied
Scientific EffectLight curing (photopolymerization): Photopolymerisation

Implementation Method 2

performing a high-temperature annealing treatment to the insulation layer having the opening after being light cured

Methodology Applied
Scientific EffectAnnealing: Annealing

Implementation Method 3

using a chemical vapor deposition to obtain the insulation layer

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS10147598B2Manufacturing method for insulation layer, manufacturing method for array substrate and array substrate
Publication Date: 2018.12.04 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US10147598B2 patent drawing
  • US10147598B2 patent drawing

AI summary

A manufacturing method for insulation layer, a manufacturing method for array substrate and an array substrate are disclosed. Wherein, the manufacturing method for insulation layer comprises steps of: depositing an insulation layer on a substrate; exposing and developing the insulation layer in order to obtain the insulation layer having an opening; light curing the insulation layer having the opening; and performing a high-temperature annealing treatment to the insulation layer having the opening after being light cured. Adopting the manufacturing method for insulation layer of the present invention, a situation of deformation at the opening of the insulation layer can be reduced.