Integral PCB Interconnect for Signal Integrity

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Solution Overview

Problem

The increasing demand for smaller, portable devices and space-constrained applications such as missiles limits the size of circuit boards, making it difficult to accommodate traditional bulky interconnects, which also leads to signal integrity issues due to solder joints.

Innovation Solution

A printed circuit board with an integral interconnect formed by depositing multiple layers, featuring a stabilizing structure and contact, where the stabilizing structure and contact materials differ, allowing for reorientation and reduction in profile, eliminating the need for soldering and enabling optical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional bulky interconnects are used, then electrical connection is achieved, but the circuit board size increases and space is consumed

Engineering Contradiction:

Improveinterconnect volumeVSAvoidcircuit board area

Core Design Contradiction:

Volume of moving objectVSArea of stationary object

Solution Approach 1:

The interconnect is merged with the circuit board by forming it integrally as a single structure. The interconnect is formed as an extension of the circuit board substrate itself, eliminating the need for separate interconnect components and reducing overall space requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The interconnect transitions from a three-dimensional bulky structure to a planar two-dimensional structure by forming it within the circuit board layer. This dimensional reduction allows the interconnect to occupy minimal space while maintaining electrical connection functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If traditional interconnects with solder joints are used, then electrical connection is established, but signal integrity deteriorates

Engineering Contradiction:

Improvesignal integrityVSAvoidsolder joint interference

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The harmful solder joint element is extracted and removed from the interconnect structure. The interconnect is formed as a direct extension of the circuit board substrate without requiring solder joints, eliminating the source of signal interference while maintaining electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The mechanical solder joint connection system is replaced with an integrated structural connection system. The interconnect is formed as a continuous extension of the circuit board substrate, replacing the mechanical soldering process with an integrated formation process that eliminates mechanical joints and their associated signal interference.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If the circuit board is made smaller, then device portability is improved, but available space for connections decreases

Engineering Contradiction:

Improvecircuit board volumeVSAvoidconnection space

Core Design Contradiction:

Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The interconnect function is merged with the circuit board substrate by forming the interconnect as an integral extension of the board itself. This eliminates the need for additional connection space beyond the board boundaries, allowing smaller board sizes while maintaining connection capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The circuit board substrate serves multiple functions: it provides the structural base, the conductive pathways, and the interconnect structure itself. This multi-functionality eliminates the need for separate interconnect components, maximizing space utilization and enabling smaller board sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows the printed circuit board to fit within limited spaces, improves manufacturing yield by reducing soldering needs, and enhances signal quality by eliminating solder joints, while accommodating smaller device sizes.

Implementation Method 1

The stabilizing structure and contact materials differ, allowing for reorientation and reduction in profile

Methodology Applied

Scientific EffectMaterial property differentiation:

Implementation Method 2

depositing multiple layers, featuring a stabilizing structure and contact

Methodology Applied

Scientific EffectLayer deposition: Deposition (physical)

Data Source

PatentEP2943048B1Board integrated interconnect

Publication Date: 2024.09.18 LOCKHEED MARTIN CORP

Figure 1
Figure 2A~2C
Figure 3

AI summary

In an embodiment, a method includes forming a printed circuit board 110 by depositing a first plurality of layers 115 and forming an interconnect 120 integral to the printed circuit board by depositing a second plurality of layers 121 on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure 125 and a contact 130 positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.