Integrated Air-Water Cooling Device for Electronics
Solution Overview
Problem
Conventional heat transfer systems for electronic components, such as air/water heat exchangers and heat sinks, are either expensive and complex or less efficient due to the need for multiple plumbing connections and thermal interface materials, which increase costs and reduce reliability.
Innovation Solution
A heat transfer system with a single integrated heat transfer device that directly interfaces with both air and water, reducing thermal resistance and production costs by eliminating excess material and thermal interfaces, and utilizing thermally conductive materials like aluminum or copper alloys, along with optimized protrusion geometries to enhance heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tube fin heat exchangers are used, then heat transfer efficiency is improved, but device complexity and cost increase due to multiple plumbing connections
Solution Approach 1:
The patent combines the heat exchanger and cold plate into a single integrated unit, eliminating the need for separate plumbing connections. The integrated design merges the water cooling channel and air cooling fins into one component, reducing assembly complexity while maintaining heat transfer efficiency.
Solution Approach 2:
The integrated heat transfer device serves multiple functions simultaneously: it acts as both a cold plate for water cooling and a heat exchanger for air cooling. This multi-functionality eliminates the need for separate components and plumbing connections for each cooling method.
2Device complexity
If heat sinks with thermal interface materials are used, then device complexity is reduced, but heat transfer efficiency decreases due to additional thermal resistance
Solution Approach 1:
The integrated design eliminates the need for separate thermal interface materials by combining the heat exchanger and cold plate into one piece. The direct contact between the water channel and air fins within the integrated structure removes thermal interface resistance while maintaining installation simplicity.
3Ease of manufacture
If multiple separate cooling components are used, then ease of manufacture is improved, but reliability decreases due to more interface points for failure
Solution Approach 1:
The patent manufactures the heat exchanger and cold plate as a single integrated component, reducing the number of interface points where failures can occur. While the manufacturing process is slightly more complex, the overall system reliability improves significantly due to fewer assembly steps and interface points.
4Reliability
If traditional heat exchangers with multiple connections are used, then heat transfer efficiency is improved, but production cost increases
Solution Approach 1:
The integrated design reduces production costs by eliminating the need for multiple separate components and their associated plumbing connections. The single-unit construction reduces material costs, assembly costs, and maintenance costs while maintaining heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved heat transfer efficiency and reduced thermal resistance by directly interfacing with both air and water, potentially lowering production costs and increasing reliability compared to traditional methods.
Implementation Method 1
a heat transfer device configured to transfer heat from the first fluid to the second fluid
Implementation Method 2
a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid
Data Source
AI summary
Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.