Bent Electronic Device Protective Substrate with Gap-Free Co-Forming
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Solution Overview
Problem
Existing protective substrates with bent portions in electronic devices, composed of non-integrated glass and plastic, are prone to moisture ingress and foreign matter entry due to gaps between materials, affecting device quality and performance.
Innovation Solution
A protective substrate with a concave portion and a flat portion, integrally formed through thermoforming, eliminates gaps by integrating glass and plastic, ensuring a seamless structure that prevents moisture and foreign matter ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If non-integrated glass and plastic are used to form a protective substrate with a bent portion, then the protective substrate can achieve a bent shape, but gaps between the glass and plastic allow moisture and foreign matter to enter the electronic device
Solution Approach 1:
The patent merges glass and plastic into a single integrated protective substrate through co-forming technology. The glass and plastic layers are formed simultaneously as one unified structure with a bent portion, eliminating the gaps that would otherwise exist between separate components. This integration ensures continuous protection against moisture and foreign matter while maintaining the desired bent shape.
Solution Approach 2:
The patent uses a composite structure consisting of multiple layers including glass layers and plastic layers that are co-formed together. The composite material approach allows the protective substrate to combine the advantages of both glass (hardness, scratch resistance) and plastic (flexibility, bendability) while the integrated formation prevents gaps between materials.
2Ease of manufacture
If non-integrated glass and plastic are used to form a protective substrate, then the protective substrate can be assembled from separate components, but foreign matter such as dust can easily enter the gap between materials
Solution Approach 1:
The patent combines the manufacturing steps into a single co-forming process where glass and plastic are formed together as an integrated protective substrate. This eliminates the need for separate assembly steps and the associated gaps that would allow foreign matter entry, while still achieving the desired bent shape and protective functionality.
3Strength
If glue is used to connect glass and plastic in a protective substrate, then the components can be joined together, but moisture can pass through the glue and enter the electronic device
Solution Approach 1:
The patent eliminates the need for glue by merging the glass and plastic into a single integrated structure formed through co-forming. The unified structure provides both mechanical strength and continuous moisture protection without requiring additional adhesive materials that would create potential pathways for moisture ingress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances device quality by preventing moisture and foreign matter entry, improving sensitivity and stability, while maintaining a uniform thickness and structure.
Implementation Method 1
The protective substrate is formed by thermoforming
Data Source
AI summary
An electronic device is provided, including an electronic element, and a protective substrate. The protective substrate includes a concave portion, and a flat portion. The concave portion has a concave surface and a convex surface that is opposite to the concave surface. The flat portion is connected to the concave portion. The electronic element overlaps the concave portion and is arranged under the convex surface.