Integrated Capacitor Assembly Monolithic Structure
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Solution Overview
Problem
Existing capacitor technologies face challenges in achieving high capacitance, small component footprint, robust mechanical assembly, and predictable frequency response over a wide range of frequencies, particularly in modern applications such as wireless communications and microwave integrated circuitry.
Innovation Solution
The development of single layer capacitive devices with pre-fired ceramic layers and metallization, combined with multilayer capacitors in integrated assemblies, allows for adjustable dimensions and materials, providing high capacitance, controlled frequency response, and robust mechanical connections, including the use of bonding materials for temperature resistance and versatile mounting options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple capacitors are combined into a monolithic structure, then high capacitance is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple capacitor elements into a single monolithic structure where multiple dielectric layers and electrode patterns are integrated within one component. This merging approach achieves high total capacitance while maintaining a unified structure rather than using separate discrete capacitors.
Solution Approach 2:
The patent utilizes multiple dielectric layers stacked in the vertical dimension to increase capacitance without proportionally increasing the horizontal footprint. By transitioning from a single-layer to multi-layer architecture, the design achieves higher capacitance density while controlling overall device complexity.
2Area of stationary object
If component footprint is reduced, then space efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent compensates for reduced horizontal footprint by increasing the vertical dimension through multiple dielectric layers. This dimensional transition allows smaller footprint while distributing manufacturing tolerances across multiple layers rather than requiring extreme precision in a single thin layer.
Solution Approach 2:
The capacitor is divided into multiple discrete dielectric layers and electrode segments, each with controlled dimensions. This segmentation allows incremental manufacturing with standard precision tolerances applied to each layer, rather than requiring single-step high-precision fabrication of the entire compact structure.
3Reliability
If frequency response predictability is improved, then performance reliability increases, but device complexity increases
Solution Approach 1:
The patent controls frequency response characteristics by adjusting dielectric material properties, layer thicknesses, and electrode geometries. By systematically varying these parameters during design, predictable frequency response is achieved without requiring complex additional structures or components.
Solution Approach 2:
The monolithic capacitor structure serves multiple functions simultaneously: energy storage, frequency response filtering, and impedance matching. This multi-functionality is achieved through the inherent properties of the integrated structure rather than adding separate components, thereby improving reliability without proportionally increasing complexity.
4Strength
If robust mechanical assembly is achieved, then structural strength is improved, but ease of manufacture decreases
Solution Approach 1:
The patent integrates multiple capacitor elements into a single monolithic structure that is formed as one unified component rather than assembling separate parts. This merging eliminates the need for mechanical assembly steps while maintaining structural robustness through the integrated architecture.
Solution Approach 2:
The capacitor utilizes composite dielectric and electrode materials that provide both mechanical strength and electrical functionality within each layer. These composite structures contribute to overall structural robustness while being compatible with standard thin-film fabrication processes, balancing strength requirements with manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated capacitor assemblies offer high capacitance, predictable impedance versus frequency characteristics, and robust mechanical connections, enabling effective performance from 20 kHz to 40 GHz with a small footprint, suitable for various circuit applications including stripline width matching in microwave integrated circuitry.
Implementation Method 1
a pre-fired ceramic layer, one or more portions of a first metallization, and one or more portions of a second metallization
Implementation Method 2
pre-fired ceramic layer
Implementation Method 3
respective portions of bonding material attach respective first terminations of the single layer device and the multilayer capacitor
Data Source
AI summary
A single layer capacitive device including a portion of pre-fired ceramic material and one or more terminations is formed with manufacturing steps that are easily modified to customize size and other aspects of such devices. The single layer devices may be utilized by themselves or selectively combined with MLCs to form integrated capacitor assemblies yielding many desirable performance characteristics in a monolithic assembly. An exemplary integrated capacitor assembly advantageously provides customized frequency response and capacitance in limited real estate. Predictable and generally constant or “flat” impedance versus frequency is afforded mainly by the properties of the single layer device, while higher capacitance is provided mainly from features of one or more associated MLCs. High structural integrity of exemplary integrated capacitor assemblies is achieved due to the disclosed attachment methods. Exemplary integrated capacitor assembly embodiments of the presently disclosed technology have been found to provide effective DC blocking from 20 kHz to 40 GHz.