Integrated Capacitor in Power Module Housing for EMC Protection
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Solution Overview
Problem
Existing power modules for electric vehicles have insufficient lifespan and reliability due to inadequate protection against electromagnetic compatibility (EMC) disturbances, which affects the longevity and performance of electronic components.
Innovation Solution
Incorporating a dielectric film capacitor within the power module's housing, positioned above the electronic components, provides effective EMC protection while maintaining compactness, using conductors with insulating materials and auxiliary housings to support the capacitor and ensure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capacitor is integrated within the power module housing, then reliability and service life are improved through better EMC protection, but device complexity increases
Solution Approach 1:
The patent integrates the capacitor directly within the power module housing, combining the capacitor function with the existing module structure. This merging approach improves reliability through better EMC protection while avoiding the need for separate external capacitor assemblies, thus limiting the increase in device complexity.
Solution Approach 2:
The housing structure is designed to serve multiple functions: it provides mechanical protection for power electronic components, electromagnetic shielding through integrated capacitors, and structural support. The housing becomes a multi-functional element that reduces overall system complexity by eliminating the need for separate protective and shielding components.
2Reliability
If a capacitor is integrated within the power module housing, then EMC protection is improved, but volume increases
Solution Approach 1:
The capacitor is nested within the existing housing structure, utilizing available internal space rather than adding external volume. The capacitor is positioned in the housing cavity above the printed circuit board, effectively using the vertical space already allocated in the module design.
Solution Approach 2:
The capacitor is arranged in the vertical dimension above the printed circuit board rather than extending the horizontal footprint. This dimensional arrangement provides EMC protection while maintaining a compact footprint suitable for electric motor vehicle applications where space is constrained.
3Reliability
If the capacitor is arranged above the electronic components, then EMC protection is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The housing is segmented into functional zones: a lower section containing the printed circuit board with power electronic components, and an upper section housing the capacitor. This segmentation allows each component to be positioned in its optimal location while maintaining clear manufacturing boundaries and assembly sequences.
Solution Approach 2:
The housing is designed with pre-defined mounting locations and alignment features for the capacitor, allowing it to be positioned accurately above the printed circuit board. The auxiliary housing or recesses are formed in advance during molding, eliminating the need for complex post-assembly positioning operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated capacitor enhances the reliability and lifespan of power modules by attenuating EMC disturbances, offering robust protection to electronic circuits while maintaining a small footprint, suitable for electric vehicles.
Implementation Method 1
a device forming an electrical capacitor is housed in the housing
Implementation Method 2
the device forming an electrical capacitor is a capacitor consisting of a dielectric film surrounded by an envelope
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The module has a parallelepiped housing (1) comprising a bottom (2), which is housed with power electronics components i.e. chips (13), and an upper wall (7). A capacitance forming device is placed in the housing, where the device is formed of a dielectric film (16) surrounded by an envelope (15). The capacitance is placed above the components on a side of the upper wall. An auxiliary housing is formed in the upper wall of the housing, where the capacitance forming device is received in the auxiliary housing. The components are arranged on conductors in the form of copper strips (11). An independent claim is also included for an electronic power module and electronic control card assembly.