Patterned metallization and solder reflow attach SiC components without large epoxy nozzles, improving placement, cost, and reliability.
A press-fit busbar replaces welded terminal joints, enabling easy module reassembly while lowering resistance and joint stress.
Interdigitated plate contacts expand capacitor surface area to raise microelectronic capacitance density without changing process flow or cost.
A bent capacitor bus bar accommodates dimensional variance and enables reliable laser welding to the main bus bar in EV electronics.
An added mechanical-electrical capacitor connection shortens current paths, cutting impedance and EMC issues in compact vehicle power converters.
Perpendicular lead extension portions increase rigidity, reduce vibration damage from inertial forces, and help prevent shorts.
Segmented equivalent circuit model minimizes impedance prediction errors by isolating frequency-dependent parasitic effects across parallel branches.