Fixed Capacitor Terminals TRIZ Cases

Patterned metallization and solder reflow attach SiC components without large epoxy nozzles, improving placement, cost, and reliability.

A press-fit busbar replaces welded terminal joints, enabling easy module reassembly while lowering resistance and joint stress.

Interdigitated plate contacts expand capacitor surface area to raise microelectronic capacitance density without changing process flow or cost.

A bent capacitor bus bar accommodates dimensional variance and enables reliable laser welding to the main bus bar in EV electronics.

An added mechanical-electrical capacitor connection shortens current paths, cutting impedance and EMC issues in compact vehicle power converters.

Perpendicular lead extension portions increase rigidity, reduce vibration damage from inertial forces, and help prevent shorts.

Segmented equivalent circuit model minimizes impedance prediction errors by isolating frequency-dependent parasitic effects across parallel branches.

Segmented crystal layers with adhesive gaps stabilize manufacturing of polarization-inverted structures without heavy loads.

Spray-formed gradient electrodes bond ceramic substrates, reducing silver costs and pollution while preventing interface separation.

Introducing a semiconductor layer at the electrode interface prevents gas penetration through weak adhesion zones, ensuring reliability in harsh environments.

Angled flat copper connection plates integrate into a low-inductance busbar system, simplifying assembly while maintaining hermetic seal integrity.

Segmented firing and heat treatment restore magnetic body characteristics while preventing internal conductor oxidation.

Resin filling between capacitor elements cushions cathode layers during injection molding, preventing compression damage that increases ESR and leakage current.

A dielectric film capacitor nested within the power module housing attenuates electromagnetic interference signals.