Interdigitated Microelectronic Capacitor Structure for Higher Density

The electrode plates are segmented into multiple sections along their length, with capacitor plate contacts formed at different locations. This segmentation allows the capacitor to utilize multiple regions of the plate structure, increasing the effective capacitance area without requiring a complete redesign of the electrode architecture. The segmented contacts enable independent formation processes for different contact regions.

Capacitor plate contacts are added in the vertical dimension by forming them at different heights or levels relative to the plate structure. This multi-level contact arrangement increases the three-dimensional utilization of the capacitor volume, effectively increasing capacitance density without expanding the planar footprint. The contacts extend from different levels to connect to respective electrodes, creating a stacked or interleaved configuration.

The capacitor plate contacts are formed using preliminary patterning and deposition steps that are integrated into the existing capacitor fabrication sequence. The contact regions are defined and prepared in advance before the final electrode assembly, allowing for precise placement without requiring additional complex alignment steps later in the process. This preliminary formation simplifies the overall manufacturing by establishing contact positions early when the structure is more accessible.

The capacitor plate contacts serve multiple functions: they provide electrical connection to the electrode plates, define the active capacitance regions, and facilitate the interdigitated structure formation. By designing the contacts to fulfill multiple roles simultaneously, the patent reduces the need for separate dedicated structures for each function, thereby simplifying the overall manufacturing process while achieving increased capacitance.