Lead Structure for Vibration-Resistant Electronic Components
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Solution Overview
Problem
Electronic components with leads face reliability issues due to damage from inertial forces during vibrations, particularly when the distance between the substrate and the element is greater than designed, leading to increased load on the leads and potential damage.
Innovation Solution
The electronic component design includes first and second leads with extension portions that extend in a direction perpendicular to the connection and bonding portions, allowing for increased distance between the substrate and the element, and twisted intermediate and interference portions that interfere with the substrate to enhance rigidity and prevent shorts, thereby reducing the likelihood of lead damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between the substrate and the element is increased, then the likelihood of shorts is reduced, but the load on the leads increases and reliability deteriorates
Solution Approach 1:
The patent introduces extension portions that protrude in a direction substantially perpendicular to the longitudinal directions of the leads, creating a three-dimensional structure. This dimensional change allows the leads to achieve both increased separation distance (reducing shorts) and enhanced rigidity (improving reliability) by distributing inertial forces across multiple spatial dimensions rather than along the lead length alone.
2Object-affected harmful factors
If the distance between the substrate and the element is increased, then shorts are prevented, but the leads become more susceptible to damage from inertial forces
Solution Approach 1:
The extension portions create a three-dimensional configuration where the leads achieve greater effective separation distance while the perpendicular orientation provides additional structural support. This dimensional change allows the leads to resist inertial forces more effectively while maintaining the increased spacing needed to prevent shorts.
Solution Approach 2:
The extension portions are configured with curved surfaces that protrude perpendicular to the lead longitudinal directions. These curved geometries distribute stress more evenly and provide structural reinforcement, enhancing lead strength while maintaining the increased separation distance needed to prevent shorts.
3Reliability
If the leads are made more rigid to resist inertial forces, then reliability improves, but the device complexity increases
Solution Approach 1:
The leads are divided into distinct functional portions: connection portions, extension portions, and interference portions. Each segment serves a specific purpose - the extension portions provide rigidity and perpendicular support, while the interference portions engage with the substrate. This segmentation allows the complex rigid structure to be manufactured using standard multi-stage molding processes without excessive complexity.
Data Source
AI summary
According to one embodiment, an electronic component includes an element, a first lead, and a second lead. The element includes a first electrode and a second electrode. The first lead is electrically connected with the first electrode, and has a flattened cross section. The second lead is electrically connected with the second electrode. The first lead includes a first connection portion, a first bonding portion, and a first extension portion. The first connection portion is connected with the first electrode. The first bonding portion is configured to be bonded with a substrate. The first bonding portion extends in an extension direction perpendicular to a first counter direction. The first counter direction connects the first electrode and the second electrode. The first extension portion is located between the first connection portion and the first bonding portion. The first extension portion extends in the extension direction.