Integrated Card-Adapter Heat Sink for Multi-Card Thermal Management
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Solution Overview
Problem
Existing solutions fail to effectively mount and cool multiple smaller circuit card assemblies within a larger VITA-compliant rack space while providing adequate thermal management and physical support, as they often compromise on heat dissipation and structural integrity.
Innovation Solution
An integrated adapter with a thermally-conductive frame and guide rails is designed to support two smaller circuit card assemblies within a larger space, utilizing a thermally-conductive frame and guide rails to conduct heat and provide structural support, allowing for efficient thermal management and vibration reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If adapters are used to mount smaller circuit card assemblies in larger rack space, then space utilization is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent combines the mechanical support function and thermal management function into a single integrated adapter assembly. The thermally-conductive frame structure simultaneously provides structural support for mounting smaller circuit card assemblies and serves as a heat sink for thermal management, eliminating the need for separate support and cooling components.
Solution Approach 2:
The adapter assembly performs multiple functions: it provides mechanical support for smaller circuit card assemblies, conducts heat away from the cards, and interfaces with the larger rack space. The thermally-conductive frame serves both as a structural support element and as a thermal conduction pathway, demonstrating multi-functionality that resolves the contradiction between space utilization and thermal management.
2Area of stationary object
If adapters are used to mount smaller circuit card assemblies in larger rack space, then space utilization is improved, but structural support capability deteriorates
Solution Approach 1:
The patent merges the support function with the thermal management function in a single integrated structure. The thermally-conductive frame provides both mechanical support for the smaller circuit card assemblies and thermal conduction pathways, ensuring that space utilization improvements do not compromise structural integrity.
3Adaptability or versatility
If existing adapter solutions are used, then mounting capability is improved, but vibration reduction capability deteriorates
Solution Approach 1:
The integrated adapter assembly combines mounting capability with vibration reduction in a single structure. The thermally-conductive frame not only supports the smaller circuit card assemblies but also provides structural rigidity that reduces vibrations, improving reliability without sacrificing adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adapter enables efficient heat removal and structural support for multiple smaller circuit card assemblies within a larger rack space, enhancing thermal management and reducing vibrations, thus improving the overall performance and reliability of the system.
Implementation Method 1
a thermally-conductive frame defining a front, a back, a top, a bottom, a left side, a right side, and an inboard region; two vertical thermally-conductive guide rails disposed on the front of the thermally-conductive frame
Data Source
Figure 1
Figure 2A
Figure 2B~2C
AI summary
An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame (30) and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails (50, 50'), extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.