Integrated Circuit Testing With Combined Burn-In And Automated Tests
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Solution Overview
Problem
The testing of semiconductor devices is a time-consuming process, particularly in the context of miniaturized integrated circuits, where stricter design and manufacturing specifications require more rigorous testing protocols.
Innovation Solution
A method and system for simultaneously performing a burn-in test and automated test on integrated circuits, utilizing a carrier wafer with heater chips to apply thermal and environmental stress, thereby reducing testing time and eliminating the need for separate burn-in boards or ovens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate burn-in testing and automated testing are performed sequentially, then each test can be conducted with dedicated equipment and protocols, but the total testing time is significantly extended
Solution Approach 1:
The patent combines burn-in testing and automated testing into a single integrated test flow. The burn-in test and automated test are performed sequentially within the same testing session using the same test equipment, eliminating the need for separate testing processes and reducing total testing time while maintaining comprehensive quality assurance.
Solution Approach 2:
The testing system is designed to perform multiple functions: it can conduct burn-in testing, automated testing, and both can be combined in a single session. The test equipment and methodology are universally applicable to different test types, allowing flexible configuration of test sequences and enabling the integration of previously separate testing processes.
2Productivity
If miniaturization is pursued to reduce device size and power consumption, then device functionality and speed are improved, but design and manufacturing specifications become stricter requiring more rigorous testing
Solution Approach 1:
The testing process maintains continuous operation through automated testing that can run for extended periods without interruption. The burn-in test phase is followed immediately by automated testing in the same session, ensuring continuous monitoring and evaluation of device performance throughout the entire testing duration, which is critical for detecting subtle manufacturing variations in miniaturized devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the testing time by integrating burn-in and automated tests, allowing for early detection of failures and reducing overall testing duration while maintaining effective quality control.
Implementation Method 1
utilizing a carrier wafer with heater chips to apply thermal and environmental stress
Data Source
AI summary
A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design corresponding to the integrated circuit. The performing the simulation includes simultaneously performing a burn-in test of an integrated circuit and an automated test of the integrated circuit. The integrated circuit is coupled to the test circuit board. The burn-in test has a minimum burn-in temperature of the integrated circuit or a burn-in heat distribution across the integrated circuit. The simultaneously performing the burn-in test of the integrated circuit and the automated test of the integrated circuit includes configuring at least the set of circuit blocks or the first set of heaters as a first set of heat sources for the burn-in test of the integrated circuit thereby generating a first heat signature of the integrated circuit.