Integrated Circuit Dummy Connectors for Bridge Die Crack Prevention
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Solution Overview
Problem
The 3D memory stack technology faces challenges in preventing the bridge die from cracking during the manufacturing process, which affects the yield and cost-effectiveness of the integrated circuit structure.
Innovation Solution
The introduction of dummy connectors, which are electrically insulated from the active connectors and interconnection structure, helps to reduce thickness variations in the semiconductor substrate, thereby preventing cracking and enhancing the yield by distributing pressure evenly during the grinding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the bridge die is used to connect with other dies in 3D memory stack, then the integration performance is improved, but the bridge die is prone to cracking during manufacturing process
Solution Approach 1:
The patent applies local quality by creating dummy connectors with different properties than active connectors. The dummy connectors are electrically insulated from the interconnection structure while active connectors are electrically connected, allowing different regions of the substrate to have different functional qualities that address both integration and cracking resistance needs
Solution Approach 2:
The dummy connectors serve as intermediary elements that distribute mechanical stress during the grinding process. These intermediary structures absorb and redistribute pressure evenly across the substrate, preventing stress concentration that would cause cracking in the bridge die
2Ease of manufacture
If the thickness of semiconductor substrate is reduced for grinding process, then the manufacturing efficiency is improved, but the thickness variation causes cracking
Solution Approach 1:
The dummy connectors are formed beforehand in the substrate before the grinding process. These pre-formed structures act as cushioning elements that compensate for thickness variations during grinding, distributing mechanical stress and preventing cracking that would otherwise occur due to non-uniform thickness
3Reliability
If dummy connectors are added to distribute pressure evenly, then the cracking resistance is improved, but the device complexity increases
Solution Approach 1:
The dummy connectors perform multiple functions: they distribute mechanical stress during grinding to prevent cracking, and they maintain structural uniformity across the substrate. By making these multi-functional elements, the patent reduces the need for separate stress-management structures, thereby limiting the increase in overall device complexity
Data Source
AI summary
An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.