Integrated Coil Isolator Layout for Precise Magnetic Coupling
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Solution Overview
Problem
Existing isolator modules face challenges in maintaining the alignment and coupling efficiency of primary and secondary coils, leading to increased complexity and size, as well as potential deterioration of characteristics and reliability due to the need for adhesive materials and complex assembly processes.
Innovation Solution
The isolator module integrates primary and secondary coils within the same wiring board, reducing the need for adhesive materials and simplifying the assembly process, while maintaining efficient coupling through direct pad connections and flip-chip bonding, which enhances reliability and reduces module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive materials are used to assemble primary and secondary coils, then the coils can be connected, but the alignment precision and coupling efficiency deteriorate
Solution Approach 1:
The patent merges the primary coil and secondary coil into a single integrated structure where the secondary coil is formed directly on the same substrate as the primary coil. This eliminates the need for separate assembly with adhesive materials, thereby maintaining precise alignment and high coupling efficiency while simplifying the manufacturing process.
2Reliability
If complex assembly processes are used to maintain coil alignment, then coupling efficiency is maintained, but device complexity increases
Solution Approach 1:
The patent implements preliminary action by pre-forming the secondary coil structure on the substrate in the same manufacturing process as the primary coil, before final assembly. This ensures precise alignment is built-in from the start, eliminating the need for complex alignment procedures during assembly and reducing overall device complexity while maintaining high coupling efficiency.
3Ease of manufacture
If adhesive materials are used for coil assembly, then connections are established, but dielectric strength deteriorates
Solution Approach 1:
The patent extracts and eliminates adhesive materials from the coil assembly process by forming the primary and secondary coils as integrated conductive structures on the same substrate. This removal of adhesive materials directly improves dielectric strength while maintaining ease of manufacture through the integrated fabrication process.
4Ease of manufacture
If traditional isolator module assembly is used, then circuits are connected, but module size increases
Solution Approach 1:
The patent merges multiple discrete components into a single integrated structure where the primary coil, secondary coil, and their interconnections are formed on the same substrate. This consolidation dramatically reduces the overall module size while maintaining ease of manufacture through standard integrated circuit fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes coil displacement, maintains high coupling coefficients, and simplifies the production process, resulting in a more reliable and compact isolator package with improved dielectric strength and reduced size.
Implementation Method 1
a first coil arranged at a same height as the first insulating layer, and a second coil arranged at a same height as the second insulating layer and facing the first coil
Data Source
AI summary
According to one embodiment, an isolator includes an isolator module including a first substrate, a first insulating layer in contact with a top surface of the first substrate, a second insulating layer in contact with a bottom surface of the first substrate, a first coil arranged at a same height as the first insulating layer, and a second coil arranged at a same height as the second insulating layer and facing the first coil; a first conductor arranged below the isolator module and electrically connected to a bottom surface of the second coil; and a first chip, wherein the second coil and a top surface of the first chip are electrically connected to each other with the first conductor interposed.