Integrated controller and vehicle including the same
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Solution Overview
Problem
Integrated controllers with Advanced Driver Assist Systems (ADAS) in vehicles generate excessive heat, necessitating effective heat dissipation solutions to prevent temperature fluctuations and ensure system reliability.
Innovation Solution
The integration of a heat dissipation fin structure on the printed circuit board, thermal grease for improved heat transfer, and a vehicle air conditioning system that adjusts airflow based on calculated heat capacity values to maintain optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-performance application processor or field-programmable gate array chips are added to the integrated controller to enhance ADAS functionality, then the processing capability and sensor fusion performance are improved, but heat generation increases
Solution Approach 1:
The patent extracts the heat dissipation function as a separate structural component (heat dissipation fin structure) from the integrated controller housing. The fin structure is positioned to surround the printed circuit board, creating a dedicated heat management system that separates thermal management from the computational function, allowing high-performance chips to operate while heat is actively managed through the fin structure's large surface area.
Solution Approach 2:
The patent applies thermal grease at specific locations where heat generation is most intense - on the surface of the printed circuit board and housing components that are in direct contact with heat-generating elements. This localized application of high thermal conductivity material ensures efficient heat transfer from critical areas without requiring thermal management throughout the entire housing, optimizing heat dissipation where it is most needed.
2Temperature
If thermal grease is applied to improve heat transfer from the printed circuit board to the housing, then heat dissipation efficiency is improved, but the complexity of assembly increases
Solution Approach 1:
The patent merges the thermal grease application with the existing housing and printed circuit board assembly process. The thermal grease is applied to surfaces that are already part of the structural assembly, combining the thermal management function with the mechanical assembly steps rather than requiring a separate thermal management assembly process. This integration minimizes additional manufacturing complexity while achieving effective heat transfer.
3Temperature
If the integrated controller is designed with a heat dissipation fin structure surrounding the printed circuit board, then heat dissipation performance is improved, but the device volume increases
Solution Approach 1:
The patent implements the heat dissipation fin structure as a nested configuration where the fin structure surrounds and encloses the printed circuit board within the housing. The fins are positioned in the space between the circuit board and the outer housing walls, utilizing otherwise wasted internal volume for heat dissipation purposes. This nested arrangement provides effective heat dissipation surface area without significantly increasing the external dimensions of the integrated controller.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat generation and prevents excessive temperature fluctuations in the integrated controller, ensuring it operates stably and is less sensitive to external temperatures, thereby enhancing the reliability of ADAS systems in vehicles.
Implementation Method 1
a thermal grease provided on at least a part of a surface of the at least one printed circuit board and at least a part of a surface of the housing
Implementation Method 2
a housing of a heat dissipation fin structure positioned to surround the printed circuit board
Implementation Method 3
a housing of a heat dissipation fin structure positioned to surround the printed circuit board
Data Source
AI summary
An integrated controller can be equipped with an advanced driver assistance system (ADAS) of a vehicle. The integrated controller includes a printed circuit board, a housing of a heat dissipation fin structure positioned to surround the at least one printed circuit board, a thermal grease provided on a surface of the printed circuit board and on a surface of the housing, and a bolt fastening portion connecting the printed circuit board to the housing.