Integrated Cooling System for Computing Devices
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Solution Overview
Problem
Existing cooling integrated systems require users to manually connect the cooling apparatus and the server's cooling channel, which is inconvenient and prone to errors.
Innovation Solution
A cooling integrated system with a housing containing a pre-integrated cooling apparatus, including a heat exchange mechanism, liquid inlet and return pipes, and a delivery pump, which are configured to circulate coolant between the heat exchange mechanism and the server's cooling channel without user intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cooling apparatus components are separately configured during manufacturing, then device flexibility and ease of assembly are improved, but installation complexity and user burden increase
Solution Approach 1:
The patent combines multiple cooling apparatus components (cooling pump, heat exchange mechanism, liquid inlet pipe, liquid return pipe) into a single integrated cooling apparatus that is pre-assembled within the housing. This merging eliminates the need for users to manually connect separate components, thereby reducing installation complexity while maintaining manufacturing flexibility.
Solution Approach 2:
The cooling apparatus components are pre-assembled and integrated into the housing during manufacturing before delivery to the user. This preliminary assembly action transfers the assembly burden from the user installation phase to the manufacturing phase, resolving the contradiction between manufacturing ease and installation simplicity.
2Adaptability or versatility
If users manually connect cooling apparatus and cooling channel, then adaptability to different configurations is improved, but risk of human error and installation time increase
Solution Approach 1:
By integrating the cooling apparatus components into a pre-assembled unit within the housing, the patent reduces the number of connection points and interfaces that users must handle. This merging maintains adaptability through the integrated design while significantly reducing connection error risk by eliminating multiple manual connection steps.
3Ease of operation
If cooling apparatus is integrally packaged in housing, then ease of installation and error reduction are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the cooling system into distinct functional modules (cooling pump, heat exchange mechanism, piping) that are integrated within the housing. This segmentation allows for standardized manufacturing of each module while achieving integral packaging, thereby managing manufacturing complexity through modular design.
Solution Approach 2:
The integrated cooling apparatus is designed as a universal module that can serve multiple cooling configurations through its standardized interfaces and components. This multi-functionality approach manages integration complexity by creating a versatile unit that can adapt to different server cooling channel configurations without requiring custom integration for each case.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated system eliminates the need for user assembly, enhancing convenience and reducing the risk of human error, while maintaining efficient heat dissipation through liquid cooling.
Implementation Method 1
The delivery pump is installed on the liquid inlet pipe and/or the liquid return pipe and configured to circulate coolant between the heat exchange mechanism and the cooling channel
Implementation Method 2
The heat exchange mechanism and the cooling channel are communicated by the liquid inlet pipe, and the heat exchange mechanism and the cooling channel are communicated by the liquid return pipe
Implementation Method 3
the specific heat capacity of liquid is much greater than that of air and the heat dissipation speed of liquid is much greater than that of air
Implementation Method 4
working fluid is utilized as an intermediate heat transmission medium, to transfer heat from a hot area to a distant location for further cooling
Data Source
AI summary
It relates to the technical field of cooling devices, a cooling integrated system configured to cool a computing device provided with a cooling channel, which includes a housing and a cooling apparatus integrally packaged inside the housing. The cooling apparatus includes a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe, and a delivery pump. The heat exchange mechanism and the cooling channel are communicated by the liquid inlet pipe, and the heat exchange mechanism and the cooling channel are communicated by the liquid return pipe. The delivery pump is installed on the liquid inlet pipe and/or the liquid return pipe and configured to circulate coolant between the heat exchange mechanism and the cooling channel to cool the computing device. The cooling apparatuses in the cooling integrated system of the embodiments of the present application are integrally configured.