Integrated Cooling Element With Base Plates For Electronic Components
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Solution Overview
Problem
Existing cooling systems for electronic components are complex and costly due to the need for multiple fluid-cooled elements and numerous pipes, which increases production and assembly complexity and risks leakage.
Innovation Solution
A cooling element with multiple base plates attached to pipes providing parallel fluid paths allows for efficient heat transfer to multiple electronic components, eliminating the need for separate cooling elements and reducing the risk of heat transfer between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling elements with individual pipes are used for each electronic component, then each component can be cooled efficiently, but the device complexity and number of pipe joints increase significantly
Solution Approach 1:
The patent merges multiple separate cooling elements into a single integrated cooling element. Multiple electronic components are mounted on different base plates that are thermally coupled to a common heat sink structure. This consolidation reduces the number of independent cooling systems and pipe connections while maintaining effective heat removal from all components through the shared cooling element.
Solution Approach 2:
The cooling element is designed as a universal structure that can simultaneously cool multiple different electronic components. The heat sink serves as a common thermal management solution for various components mounted on different base plates, eliminating the need for component-specific cooling elements and reducing overall system complexity.
2Temperature
If multiple separate cooling elements are used, then each component receives dedicated cooling, but the production and assembly cost increases due to cumbersome assembly
Solution Approach 1:
By combining multiple cooling functions into a single manufacturing unit, the patent simplifies production processes. The integrated cooling element can be manufactured as one piece or pre-assembled module, reducing the number of assembly steps required compared to installing multiple separate cooling elements and their associated piping for each electronic component.
Solution Approach 2:
The universal cooling element design allows for standardized manufacturing processes that can serve multiple components simultaneously. This multi-functional approach reduces production complexity and assembly costs by eliminating the need to manufacture and assemble separate cooling systems for each electronic component.
3Adaptability or versatility
If numerous pipe joints are used to connect cooling elements, then fluid can reach all components, but the risk of leakage increases
Solution Approach 1:
The patent reduces the number of pipe joints by merging multiple cooling circuits into a single integrated system. Fewer connections between cooling elements mean fewer potential leakage points, thereby improving system reliability while still providing fluid distribution to all necessary locations through the consolidated cooling element and its internal fluid passages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies production and assembly, reduces the risk of leakage, and ensures efficient cooling for multiple electronic components while maintaining a reliable and cost-effective cooling system.
Implementation Method 1
The heat generated by the electronic components can therefore be transferred to the fluid
Data Source
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Figure 5
AI summary
The invention relates to a cooling element (13) for an electronic apparatus, said element comprising: an inlet (3) for receiving fluid, an outlet (4) for forwarding fluid from said cooling element (13), a plurality of pipes (1) providing parallel fluid paths for passing said fluid from said inlet (3) to said outlet (4). In order to obtain a simple and efficient cooling element a plurality of base plates (11, 12, 14) for receiving electronic components (15, 16, 17) are attached to said plurality of pipes (1) for conducting heat generated by said electronic components (15, 16, 17) to said fluid in said pipes (1).