Integrated Dryer for Component Carrier Processing
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Solution Overview
Problem
The manufacturing process of component carriers, such as printed circuit boards, is challenged by the risk of surface damage from residues and electrostatic discharge, which requires clean room conditions to prevent contamination, but chemical treatments can leave the carriers wet, potentially contaminating subsequent processing steps.
Innovation Solution
A processing apparatus with an integrated dryer device in the processing chamber that dries the component carriers before removal, using ultrasonic, infrared, or centrifugal drying methods to prevent chemical carryover and maintain clean room conditions, featuring a handler for loading and unloading and a control unit for automated processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical treatment is performed in process chambers, then component carriers can be processed, but the component carriers become wet and risk contaminating clean room conditions
Solution Approach 1:
The drying function is extracted as a separate integrated dryer device within the processing chamber, removing moisture from component carriers after chemical treatment but before they leave the chamber, thus preventing contamination of clean room conditions
Solution Approach 2:
The dryer device performs preliminary drying action within the processing chamber before the component carriers are transferred to the clean room environment, ensuring they are dry and non-contaminating before exposure to clean room conditions
2Object-affected harmful factors
If clean room conditions are maintained, then surface damage from residues is prevented, but chemical treatment efficiency may be compromised
Solution Approach 1:
The processing system is segmented into distinct functional zones: a processing chamber for chemical treatment that can operate independently of clean room conditions, and a clean room environment for subsequent steps, with the dryer device serving as the interface between these zones
Solution Approach 2:
The integrated dryer device acts as an intermediary between the chemical treatment process and the clean room environment, removing moisture that would otherwise carry chemicals out of the processing chamber and into the clean room, thus enabling both efficient chemical treatment and surface protection
3Object-affected harmful factors
If component carriers are dried after processing, then clean room conditions are maintained, but additional processing time is required
Solution Approach 1:
The dryer device is merged with the processing chamber as an integrated unit, combining the chemical treatment and drying functions in the same space, allowing drying to occur without requiring separate processing time or additional chamber cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures dry and contamination-free component carriers are processed, reducing the risk of surface damage and maintaining clean room integrity by efficiently removing moisture and chemicals, allowing for high-volume production without compromising cleanliness.
Implementation Method 1
using ultrasonic, infrared, or centrifugal drying methods
Implementation Method 2
using ultrasonic, infrared, or centrifugal drying methods
Implementation Method 3
using ultrasonic, infrared, or centrifugal drying methods
Data Source
Figure 1
Figure 2
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AI summary
The present invention relates to a processing apparatus (100) for processing component carrier structures (210) The processing apparatus (100) comprises a handler (110) configured for loading a component carrier structure (210), for supplying the component carrier structure (210) to a processing chamber (101), and for unloading the component carrier structure (210) after processing in the processing chamber (101); and the processing chamber (101) configured for processing the component carrier structure (210) and having an integrated dryer device (102) for drying the component carrier structure (210) before the handler (110) removes the component carrier structure (210) from the processing chamber (101).