Integrated Electrode Plate for Power Semiconductor Module Heat Dissipation
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Solution Overview
Problem
Conventional power semiconductor modules for vehicular inverter and relay circuits face challenges in heat dissipation due to the need for larger heat dissipation substrates to compensate for low thermal conductivity resin packages and soldered bonding, which hinders size reduction and reliability.
Innovation Solution
A power semiconductor module design featuring electrode plates with integrally formed external connection and body portions, where the semiconductor chip is mounted on one surface and sealed with resin, allowing direct heat dissipation to an external unit, and incorporating features like resin protrusions and through holes to enhance contact and anchoring, reducing the size and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor device uses individually prepared external connection terminals and heat dissipation substrate bonded by soldering, then electrical connection is achieved, but the device area increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent merges the external connection terminal and heat dissipation substrate into a single integrated electrode plate structure. The electrode plate simultaneously serves as both the electrical connection terminal and the heat dissipation substrate, eliminating the need for separate bonding processes and reducing the overall device area while maintaining reliable electrical and thermal connections.
Solution Approach 2:
The electrode plate is designed to perform multiple functions: it acts as the external connection terminal for electrical connection, serves as the heat dissipation substrate for thermal management, and provides the mounting surface for semiconductor chips. This multi-functional design resolves the contradiction by eliminating separate components and their bonding interfaces.
2Temperature
If heat emitted from semiconductor chips passes through the resin package, then heat dissipation is achieved, but the resin package with low thermal conductivity requires larger heat dissipation substrate area
Solution Approach 1:
The patent extracts the heat dissipation function from the resin package and assigns it to the electrode plate. By removing the heat dissipation substrate from the resin package structure and making it an independent integrated component, the design eliminates the limitation of low thermal conductivity resin and achieves efficient heat dissipation without requiring enlarged area.
Solution Approach 2:
The electrode plate integrates the heat dissipation function directly into the connection terminal structure. The same metal plate that provides electrical connection also serves as the heat dissipation path, eliminating the need for separate heat dissipation substrates and reducing overall device area while improving thermal performance.
3Length of stationary object
If the resin package thickness is reduced for compact design, then device size decreases, but heat dissipation performance deteriorates
Solution Approach 1:
The electrode plate merges the electrical connection and heat dissipation functions into a single integrated component that extends through the resin package. This integration allows the heat dissipation path to be independent of the resin package thickness, enabling compact design without compromising thermal performance.
4Reliability
If external connection terminal portion is bonded to resin package, then electrical connection is achieved, but vibration causes peeling and reliability deteriorates
Solution Approach 1:
The electrode plate is designed as an integrated unit where the external connection terminal and heat dissipation substrate are merged. This eliminates the bonding interface between terminal and substrate, removing the peeling risk under vibration while maintaining reliable electrical and thermal connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat dissipation and reliability by allowing direct heat transfer to external units and preventing terminal peeling, thus enabling a compact and reliable power semiconductor module suitable for vehicular rotary electric machines.
Implementation Method 1
securing electrical insulation properties
Implementation Method 2
heat emitted from the semiconductor chips passes through the heat dissipation substrate and then further passes through the thin resin package to be dissipated to a heat sink
Implementation Method 3
heat emitted from the semiconductor chips passes through the heat dissipation substrate
Data Source
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AI summary
A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.