Integrated Heatsink Leads for Thin Semiconductor Packages
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving reduced thickness while efficiently dissipating heat generated by the semiconductor die, as traditional approaches often require additional components like die pads and separate heat sinks, which increase package thickness and complexity.
Innovation Solution
The integration of leads that serve as both structural supports and heat sinks, where the lower surfaces of the leads act as exposed heat sinks and the upper surfaces form lands for electrical coupling, with encapsulation and back filling materials providing protection and mechanical support, allowing for a thinner package design without the need for a separate die pad or heat sink component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional separate heat sink and die pad components are used, then heat dissipation capability is improved, but package thickness increases
Solution Approach 1:
The patent merges the heat sink and die pad functions into a single integrated lead structure. The lead serves dual purposes: providing electrical connection and serving as both die pad and heat sink, eliminating the need for separate components and reducing overall package thickness.
Solution Approach 2:
The lead structure is designed to perform multiple functions simultaneously: electrical connection, mechanical support, die mounting platform (die pad), and thermal management (heat sink). This multi-functionality resolves the contradiction by consolidating components that traditionally increased thickness.
2Length of stationary object
If package thickness is reduced, then miniaturization is improved, but heat dissipation capability deteriorates
Solution Approach 1:
By combining the heat dissipation function directly into the lead structure that is already present in thin packages, the patent enables effective thermal management without adding thickness. The lead's inherent thermal conductivity is utilized efficiently.
Solution Approach 2:
The patent optimizes heat dissipation in the lateral dimensions through the lead structure's geometry rather than relying on vertical thickness. The lead provides thermal pathways that extend laterally, enabling effective heat removal in thin-profile packages.
3Temperature
If separate heat sink component is added, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent eliminates the need for separate heat sink components by integrating thermal management functionality directly into the lead structure. This simplification reduces assembly steps, component count, and overall device complexity.
Solution Approach 2:
The lead structure is designed as a universal component that simultaneously provides electrical connection, mechanical support, and thermal management, eliminating the need for multiple specialized components and simplifying the overall package architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of thinner semiconductor packages with integrated heat dissipation capabilities, reducing overall thickness and enhancing thermal management without increasing package size, thus addressing the need for reduced thickness and efficient heat removal.
Implementation Method 1
The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may form a heatsink
Data Source
AI summary
One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support and enclose periphery portions of the semiconductor die. The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may form a heatsink and the second surface of the leads form lands of the package for coupling to another device, substrate, or board. The package includes encapsulation material that surrounds the semiconductor die and located between upper portions of the leads. The package further includes a back filling material (or insulating material) that is below the semiconductor die and between lower portions of the leads.