Integrated High-Frequency Matching Device with Dielectric Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional high-frequency devices with transmission lines on dielectric substrates and multiple chip capacitors face issues of large circuit size, increased component count, and thermal expansion mismatches leading to cracking and peeling, which restrict package size and reliability.
Innovation Solution
The integration of high-dielectric-constant and low-dielectric-constant substrates with surface and rear electrodes, along with a conductive connection to form compact high-frequency matching devices, reduces component count and thermal stress, allowing for smaller package size and improved mounting accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a matching device uses a transmission line on a dielectric substrate and multiple chip capacitors as separate components, then the matching function can be achieved, but the occupied area becomes large and the number of components increases
Solution Approach 1:
The patent merges the transmission line and chip capacitors into a single integrated structure where the dielectric substrate serves as both the transmission line carrier and the capacitor body. The capacitor electrodes are formed on the same substrate as the transmission line, eliminating the need for separate capacitor components and reducing the overall occupied area while maintaining the matching function.
Solution Approach 2:
The dielectric substrate is designed to perform multiple functions simultaneously: it acts as the transmission line medium, the capacitor dielectric layer, and the mounting base. This multi-functionality reduces the number of separate components needed and minimizes the total area occupied by the matching device.
2Ease of manufacture
If the matching device area is increased to accommodate separate components, then component placement is easier, but the package size must increase and thermal expansion mismatch causes cracking and peeling
Solution Approach 1:
By combining the transmission line and capacitors into a single integrated substrate structure, the patent eliminates the need for separate component placement steps. All elements are formed on the same substrate, which simplifies manufacturing while reducing the overall device area, thereby minimizing thermal expansion mismatch and improving thermal stability.
3Reliability
If multiple separate components are used for the matching circuit, then the matching function can be implemented, but the number of components increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functional elements (transmission line, capacitor dielectric, capacitor electrodes) into a single integrated structure on one dielectric substrate. This consolidation reduces the number of separate components from multiple discrete parts to a single integrated component, simplifying the device while maintaining the matching function.
4Area of stationary object
If the matching device area is reduced to minimize package size, then package size is reduced, but thermal expansion mismatch increases cracking and peeling
Solution Approach 1:
By integrating all matching circuit elements onto a single dielectric substrate, the patent minimizes the overall device area and package size. The integrated structure eliminates interfaces between separate components, reducing the cumulative thermal expansion mismatch that would otherwise cause cracking and peeling, thereby improving mounting reliability despite the reduced size.
Data Source
AI summary
A high-frequency device according to one embodiment includes: a plate-like first dielectric substrate; a plurality of surface electrodes for capacitors which are formed on a surface of the first dielectric substrate; a rear face electrode for the capacitors which is formed on a rear face of the first dielectric substrate; a second dielectric substrate which is laminated on the first dielectric substrate and has an opening portion through which a plurality of the surface electrodes are exposed; a transmission line which is formed on a surface of the second dielectric substrate; and a conductive member to connect a plurality of the surface electrodes to the transmission line. The first dielectric substrate is made of dielectric material having a first dielectric constant. The second dielectric substrate is made of dielectric material having a second dielectric constant. The first dielectric constant is higher than the second dielectric constant.