Integrated Impedance Measurement Device for SoC Internal Characterization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current impedance measurement techniques for System on Chip (SoC) devices require external probing and multiple measurements, which are time-consuming and inefficient, and do not allow for internal characterization of circuit performance.
Innovation Solution
An integrated impedance measurement device is embedded within the SoC, comprising measurement circuits, a controller, and a Fast Fourier Transform (FFT) processor, which generates clock signals, detects voltages, and calculates impedance using electrical parameters, enabling internal characterization and minimizing testing time by extrapolating impedance values across frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external probing and multiple measurements are used for impedance measurement, then measurement coverage is improved, but measurement time and complexity increase
Solution Approach 1:
The patent combines multiple measurement functions into a single integrated impedance measurement device embedded within the SoC. The device integrates voltage detection circuits, current detection circuits, and control logic into one unified structure, allowing simultaneous acquisition of multiple electrical parameters without requiring separate external probing operations for each measurement.
Solution Approach 2:
The SoC performs self-diagnosis through the integrated impedance measurement device, eliminating the need for external testing equipment. The device uses internal voltage and current detection circuits to automatically measure impedance characteristics of internal nodes, enabling the system to self-characterize its electrical performance without external intervention.
2Measurement precision
If external probing is used for impedance measurement, then measurement capability is improved, but device complexity and overhead increase
Solution Approach 1:
The integrated impedance measurement device serves multiple functions within the SoC: it measures impedance at multiple internal nodes, characterizes circuit performance across different operating conditions, and provides data for both design validation and manufacturing testing. This multi-functionality reduces the need for separate dedicated testing structures.
Solution Approach 2:
The impedance measurement device is embedded within the existing SoC architecture, nesting measurement functionality inside the operational circuits. The voltage detection circuits tap into existing power domains and signal lines, while current detection is integrated into the power management network, allowing measurement functionality to be nested within the operational structure without adding external components.
3Measurement precision
If multiple separate measurements are performed, then measurement completeness is improved, but productivity and efficiency decrease
Solution Approach 1:
The integrated device enables continuous simultaneous measurement of voltage and current at multiple nodes through its parallel detection circuits. The control unit coordinates these measurements to occur concurrently rather than sequentially, maintaining continuous data acquisition across all monitored points without interruption or repetition.
Solution Approach 2:
The measurement device is segmented into independent detection channels for voltage and current, each capable of operating autonomously. This segmentation allows parallel measurement operations across multiple SoC nodes simultaneously, with each channel processing its own signal independently while contributing to the overall impedance calculation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for fast, automatic, and accurate impedance measurement within the SoC, reducing the need for external probing and enabling sub-mohm range measurements, with the ability to detect high-frequency impedances and integrate with minimal chip overhead.
Implementation Method 1
A Fast Fourier Transform (FFT) processor coupled to the measurement circuit converts the first voltage related data into second voltage related data using a fast fourier transform
Data Source
AI summary
Systems, devices, and methods are described herein for measuring an impedance of a DUT using an integrated impedance measurement device. A system includes a plurality of measurement circuits, a FFT processor, and a controller. The measurement circuits are coupled to the DUTs. Each measurement circuit is configured to generate a clock signal for a respective DUT, detect a voltage of the respective DUT, and generate first voltage related data using the clock signal and the voltage. The FFT processor is coupled to the measurement circuits. The FFT processor is configured to convert the first voltage related data into second voltage related data using a fast Fourier transform for each measurement circuit. The controller is coupled to the measurement circuits and the FFT processor. The controller is configured to calculate an impedance using the second voltage related data for each measurement circuit and output the impedance to each DUT.